Abstract: A semiconductor device comprises a plurality of quantum structures comprising predominantly germanium. The plurality of quantum structures are formed on a first semiconductor layer structure. The quantum structures of the plurality of quantum structures have a lateral dimension of less than 15 nm and an area density of at least 8×1011 quantum structures per cm2. The plurality of quantum structures are configured to emit light with a light emission maximum at a wavelength of between 2 ?m and 10 ?m or to absorb light with a light absorption maximum at a wavelength of between 2 ?m and 10 ?m.

Abstract: An undesired change of encrypted data words of a stored encrypted dataset may be concluded from the fact that redundancy information is associated with the data words of a dataset prior to encryption, wherein the redundancy information is also encrypted and stored at least partially together with the encrypted data words of the encrypted dataset as an encrypted redundancy data word. The change of the stored encrypted data words may be concluded from the fact that the decrypted data words resulting from decrypting the encrypted data words are used to form a new redundancy data word which is encrypted into a new encrypted redundancy data word. A comparison of the new encrypted redundancy data word to the encrypted redundancy data word enables to examine whether the encrypted data was changed.

Abstract: Integrated circuit having security-critical circuit components arranged in a lower plane, data lines arranged in an upper plane, situated at least in part above the security-critical circuit components arranged in the lower plane, and connected to the security-critical circuit components, and a detector circuit that identifies an attack on the integrated circuit. The detector circuit has a transmitting device that transmits predetermined test data into the security-critical circuit components arranged in the lower plane, a receiving device that receives the data processed by the security-critical circuit components arranged in the lower plane, and an evaluation device that compares the received data with expected data and that ascertains any non-correspondence. The data lines carry the predetermined test data that is transmitted by the transmitting device and is processed by the security-critical circuit components.

Abstract: A wafer frame for fixing and handling 200 mm wafers is produced with a significantly reduced weight as compared to a metal wafer frame, while maintaining mechanical and thermal material properties. This is accomplished by producing the wafer frame from a plastic with a glass fiber content of from 1 to 40% by weight.