Abstract: A mechanical switch is arranged to electrically connect a power source to an electrical component. The switch includes a resilient structure, a first electrically conductive element connected to the power source and a second conductive element connected to the electrical component. At least one of the conductive elements is attached to the resilient structure. The switch is arranged such that the conductive elements are positioned out of contact with one another in the absence of a force being applied to the switch, and the resilient structure is moveable in response to a force applied thereto, the force being applied upon rotation of a tire to which the switch is connected. Upon the application of a force above a predetermined threshold, the resilient structure moves to bring the conductive elements into contact with one another, the contact electrically connecting the power source to the electrical component.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A micro mechanical backscatter sensor includes a receiver for receiving a modulated electromagnetic signal, a capacitive element operatively connected to the receiver, the capacitive element being arranged such that a voltage is generated across the capacitor in response to the frequency of the received signal, and a resonator operatively connected to the capacitive element such that electrostatic forces that are induced by the voltage generated cause the resonator to vibrate at a resonance frequency, the resonator being arranged such that an applied external force alters the resonance frequency of vibration.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A resonant structure for a micromechanical device includes a crystalline silicon beam and at least one mass attached to the beam. An excitation plane of the resonant structure is defined by the predominant motion of the excited resonant structure. The beam includes crystal axes aligned such that none of the crystal axes are parallel to the length of the beam and/or none of the crystal axes are normal to the excitation plane.

Abstract: An apparatus that reduces parasitic capacitance in a MEMS device includes a dielectric layer on the surface of a silicon-on-insulator (SOI) substrate, a conductor embedded in the substrate and disposed between the dielectric layer and a buried oxide layer, and surface conductors on the dielectric layer and coupled to ends of the embedded conductor. A boundary region surrounds the embedded conductor and separates an inner region and an outer region of substrate, providing a p-n junction between the boundary region and the outer region of SOI substrate which is reverse biased to electrically isolate the inner region from the outer region of SOI substrate. An amplifier has an input connected to one end of the embedded conductor and an output connected to the inner region of the substrate. The amplifier senses a voltage at the input and produces a voltage that approximates the voltage at the output.

Abstract: A mechanical switch is arranged to electrically connect a power source to an electrical component. The switch includes a resilient structure, a first electrically conductive element connected to the power source and a second conductive element connected to the electrical component. At least one of the conductive elements is attached to the resilient structure. The switch is arranged such that the conductive elements are positioned out of contact with one another in the absence of a force being applied to the switch, and the resilient structure is moveable in response to a force applied thereto, the force being applied upon rotation of a tire to which the switch is connected. Upon the application of a force above a predetermined threshold, the resilient structure moves to bring the conductive elements into contact with one another, the contact electrically connecting the power source to the electrical component.

Abstract: An energy harvesting system is arranged to harvest energy generated by a rotating tire. The system comprises a chamber holding fluid and an energy converter arranged to extract kinetic energy generated by a flow of the fluid, the flow being induced by a deformation of the chamber during the tire rotation, and further arranged to convert the kinetic energy into electrical energy. A method of harvesting energy generated by a rotating tire is also provided.

Abstract: A micro-electromechanical package includes a casing and a microelectronic circuit. At least one portion of the casing includes a piezoelectric material arranged such that, in use, dynamically changing mechanical strain in the at least one portion produces an electrical charge usable as a power source by the microelectronic circuit.

Abstract: A tire pressure monitoring system receiver includes a storage unit to store transmitter IDs associated with a plurality tire pressure monitoring system transmitters, a receiving unit to receive a transmitted tire pressure monitoring system telegram and a transmitted checksum, a calculating unit to calculate a test checksum from the received telegram and one of the stored IDs, a comparing unit to compare the test checksum with the transmitted checksum, and an identification unit to identify a source transmitter from the test checksum in response to finding a match between the test checksum and the transmitted checksum.

Abstract: A micro-generator includes an integrated circuit (IC) wafer. A micro-electro mechanical system (MEMS) wafer, with a movable micromechanical element, is bonded to the IC wafer. A plurality of first metal coils associated with a plurality of trenches is arranged in one of the IC wafer and the MEMS wafer. A plurality of micro-magnets is provided in the other of the IC wafer and the MEMS wafer. Each micro-magnet is associated with a respective trench and is formed from a magnet layer deposited, plated or bonded to the MEMS wafer or IC wafer. Movement of the micro-mechanical element generates a voltage in the first metal coils.

Abstract: A tire localization system for locating the position of a tire of a vehicle having five or more wheels, includes a number of tire pressure monitoring system (TPMS) wheel modules of a vehicle TPMS, each wheel module being attached to each one of the wheels or a tire thereof, respectively. Each TPMS wheel module includes a radio frequency identification (RFID) reader. The system further includes a number of RFID tags, each RFID tag being associated with and storing wheel position information of one of the wheels, and each RFID tag being positioned externally of its associated wheel. Each of the RFID readers is arranged, upon activation, to interrogate its associated RFID tag, and the associated RFID tag is arranged, upon interrogation, to transmit its stored position information to the RFID reader for transmission by the TPMS wheel module to a central control unit. A tire localization method is also provided.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A method of manufacturing an electrical conductor for a semiconductor device having one or more layers includes etching from a first surface to a second surface of at least one layer of the device to form a channel having a wall extending from the first surface to the second surface. The channel defines a gap extending from the first surface to the second surface. An insulating layer is provided on the channel wall. Conductive material is patterned on the channel wall to form multiple separate electrical conductors, which are insulated from material of the at least one layer by the insulating layer, thereon, such that the gap that extends from the first surface to the second surface is maintained. A corresponding semiconductor device is also provided.

Abstract: A method of manufacturing capacitive elements for a capacitive device which comprises one or more layers is provided. At least one layer is etched from a first surface to a second surface thereof to form two sections of the layer, such that the sections are movable relative to one another, and such that a wall extending from the first surface to the second surface is formed on each of the two sections, the walls defining a gap therebetween. An etching step forms multiple recesses in each wall such that multiple capacitive elements are defined between adjacent recesses, the capacitive elements of one wall being offset from those of the other wall when the sections are stationary with respect to one another. A corresponding capacitive device is also provided.

Abstract: A tire pressure measurement system (TPMS) includes a capacitor and an integrated circuit configured to receive a supply voltage. The integrated circuit includes a voltage regulator and a measurement unit. The voltage regulator is configured to be turned on and off for predetermined periods of time such that the capacitor is charged and discharged, respectively. The voltage regulator and the capacitor are connected to the measurement unit in order to selectively provide electric charge at a voltage between predetermined upper and lower limits.

Abstract: A resonant structure for a micromechanical device includes a beam and at least one mass attached to the beam. The resonant structure is arranged to have a predominantly rotational excitation mode and an excitation plane in which motion of the excited resonant structure predominantly takes place, the at least one mass including a geometry such that none of the principal axes of the rotational inertia tensor of the resonant structure are normal to the excitation plane.

Abstract: A micro mechanical backscatter sensor includes a receiver for receiving a modulated electromagnetic signal, a capacitive element operatively connected to the receiver, the capacitive element being arranged such that a voltage is generated across the capacitor in response to the frequency of the received signal, and a resonator operatively connected to the capacitive element such that electrostatic forces that are induced by the voltage generated cause the resonator to vibrate at a resonance frequency, the resonator being arranged such that an applied external force alters the resonance frequency of vibration.

Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.

Abstract: A micro-electromechanical device comprises a micro-electromechanical die, a package, and three pillars attaching the micro-electromechanical die to the package, at least one of the shape, position and orientation of the pillars is configured such that any strain transferred from the package to the die by deformation of the package is minimized.