Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
Type:
Application
Filed:
April 21, 2010
Publication date:
August 12, 2010
Applicant:
Infinite Power Solutions
Inventors:
Shawn W. Snyder, Bernd J. Neudecker, Paul C. Brantner
Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
Type:
Application
Filed:
March 16, 2007
Publication date:
August 30, 2007
Applicant:
INFINITE POWER SOLUTIONS
Inventors:
Shawn Snyder, Bernd Neudecker, Paul Brantner