Patents Assigned to Information & Communications University Research & Industrial Cooperation Group
  • Patent number: 7170456
    Abstract: Disclosed herein is a dielectric chip antenna structure using a metal conductor formed at the lateral side of the antenna along the longitudinal direction of the antenna. The dielectric chip antenna structure forms the metal conductor at the long side of the antenna to induce antenna resonance through coupling effect between the antenna and the ground. Furthermore, the dielectric chip antenna structure minimizes the space occupied by the antenna and modifies the theoretical feeding structures of the reverse F type antenna and monopole antenna to meet user's various demands.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: January 30, 2007
    Assignee: Information and Communications University Research and Industrial Cooperation Group
    Inventors: Won Il Kwak, Seong Ook Park
  • Publication number: 20060192713
    Abstract: Disclosed herein is a dielectric chip antenna structure using a metal conductor formed at the lateral side of the antenna along the longitudinal direction of the antenna. The dielectric chip antenna structure forms the metal conductor at the long side of the antenna to induce antenna resonance through coupling effect between the antenna and the ground. Furthermore, the dielectric chip antenna structure minimizes the space occupied by the antenna and modifies the theoretical feeding structures of the reverse F type antenna and monopole antenna to meet user's various demands.
    Type: Application
    Filed: August 2, 2005
    Publication date: August 31, 2006
    Applicant: INFORMATION AND COMMUNICATIONS UNIVERSITY RESEARCH AND INDUSTRIAL COOPERATION GROUP
    Inventors: Won Kwak, Seong Park
  • Publication number: 20060056765
    Abstract: Disclosed herein is an architecture of connecting a transceiver module for an optical PCB, in which an active photo-electric element and other components to be integrated in the optical PCB having waveguides are packaged, waveguides arranged in the optical PCB, and an optical connection block for optical coupling between the transceiver module and the waveguides of the optical PCB. Guide pin insertion holes are formed at one sides of the ends of the waveguides such that the optical PCB, the transceiver module and the optical connection block can be passively aligned using guide pins inserted into the guide pin insertion holes.
    Type: Application
    Filed: March 1, 2005
    Publication date: March 16, 2006
    Applicant: Information and Communications University Research and Industrial Cooperation Group
    Inventors: Sung Hwang, Han Cho, Mu Cho, Hyo Park
  • Publication number: 20060051102
    Abstract: Disclosed herein is an optical interconnecting system for transmitting a large amount of data. The system includes a bidirectional transmitting/receiving circuit that is installed at each of both ends of a data line between chips or boards, selectively receives an electric signal or an optical signal, amplifies and converts the received signal and selectively outputs the signal. The optical interconnecting system integrates a transmitter and a receiver into one bidirectional transmitting/receiving circuit to reduce circuit design and manufacturing costs and decrease power consumption. The system can integrate the bidirectional transmitting/receiving circuit in a highly integrated semiconductor chip and extend it to a multi-dimension multi-channel form to produce a compact package.
    Type: Application
    Filed: February 9, 2005
    Publication date: March 9, 2006
    Applicant: Information and Communications University Research and Industrial Cooperation Group
    Inventors: Tae Lee, Sae Kang, Hyo Park
  • Publication number: 20060045418
    Abstract: Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90°. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.
    Type: Application
    Filed: March 1, 2005
    Publication date: March 2, 2006
    Applicants: Information and Communication University Research and Industrial Cooperation Group, SKC Co., Ltd.
    Inventors: Mu Cho, Han Cho, Hyo Park, Jong Lee, Kyung Kim
  • Publication number: 20050264371
    Abstract: A differential voltage controlled oscillator comprises first and second transistors having opposite magnitudes and directions of currents flowing to a third electrode from a second electrode corresponding to a voltage between first and second electrodes; and a resonance circuit coupled to the second electrodes of the first and second transistors and controlling a frequency of an oscillation signal corresponding to a control voltage. The second electrode of the first transistor is coupled to the first electrode of the second transistor to form a first output terminal, the first electrode of the first transistor is coupled to the second electrode of the second transistor to form a second output terminal, and the third electrodes of the first and second transistors are coupled to first and second powers.
    Type: Application
    Filed: June 1, 2005
    Publication date: December 1, 2005
    Applicant: Information and Communications University research and Industrial Cooperation Group
    Inventors: Sang Lee, So Shin, Seok Yun