Abstract: An inspection system including a lens. In one instance, the lens is a solid immersion lens. The inspection system includes a component or components for providing a self aligning solid immersion lens arrangement in order to allow at most a small distance between the solid immersion lens and a device under test and components or components for constraining a force exerted on the device under test. The inspection system may include a “purge” port, or a thermal isolation configuration or an anti-contamination component. The inspection system may include software and hardware to prevent crashing of the lens. The inspection system may also include a method for ensuring that various objective lenses can be replaced while maintaining the intended spacing between lenses.

Abstract: Readout integrated circuits (ROICs) for multi-band imagers, and related methods, are described. The ROICs may include multiple channels associated with the detectors of a photodetector array, with the different channels corresponding to different wavelength bands detected by the detectors. The ROICs may utilize capacitive transimpedance amplifier (CTIA) technology, and may implement time division multiplexing techniques.

Abstract: The present application relates to imagers having variable gain and related structures and methods. The gain of the imager may vary between rows of the imager. Such variability may be achieved by suitable design of a readout integrated circuit (ROIC). The ROIC may provide different integration period durations for different rows of the imager. Different integration capacitances may be provided for pixels of different rows of the imager. The gain of a column buffer may be varied when operating on output signals of pixels from different rows.

Abstract: A back-side imaging infrared microscope is integrated with a novel integrated-circuit probe station. The microscope is located below the silicon substrate of the integrated circuit, on the side opposite to the probe card. The electronic circuitry located on the top side of the substrate is imaged through the back side of the substrate and through a window sized to provide a view of a single integrated circuit and of the corresponding probe tips overlying the contact pads. Since the silicon substrate of integrated circuits is transparent to infrared wavelengths, the alignment between probe tips and contact pads is carried out with a clear view of both from the bottom of the substrate. Furthermore, emission images from the integrated circuit are taken during testing with the same microscope after electrical contact has been established.