Abstract: The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.

Abstract: The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.