Abstract: An image sensor packaging method, an image sensor packaging structure and a lens module are disclosed by the present invention provides. With the image sensor packaging method, a plurality of image sensor chips are embedded in a molding layer, thus allowing a greatly reduced thickness and improved slimness of the resulting packaging structure. Moreover, in this packaging method, instead of bonding wires, solder pads are externally connected by thin film metal layer formed on non-photosensitive surface area located on the same side as light-sensing surfaces. This allows a reduced impact on the light-sensing surfaces as well as a shorter distance from each solder pad to a corresponding one of the light-sensing surfaces along the direction parallel to the light-sensing surfaces, when compared to the use of bonding wires.

Abstract: Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.

Abstract: A display device and a method for packaging the display device are disclosed. The display device includes an optical module including multiple light-emitting units disposed apart from one another and a first plastic layer. Each light-emitting unit includes at least three LEDs, and the first plastic layer fills the gaps between the light-emitting units. The display device further includes a driver IC including a second plastic layer, driving chips, through-holes, a first structure and a second structure. The second plastic layer fills the gaps between the driving chips, and the second plastic layer has a third layer. The through-holes penetrate through the second plastic layer along a thickness direction of the through-holes and are filled with a conductive material. The first structure is electrically connected to the driving chips and to the conductive material in the through-holes. The second structure is electrically connected to the conductive material in the through-holes.

Abstract: An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are formed within a molded layer, resulting in a package with a significantly reduced thickness which is favorable to the slimming of the package. The packaging method does not involve any wire bonding process. Instead, metal pads are led out through a thin metal film formed in non-photosensitive areas on the same side of micro lens surfaces of the image sensor dies. This approach has a less adverse impact on micro lens surfaces and, compared to the wire bonding process, allows a smaller spacing from metal pads to the micro lens surfaces with respect to a direction parallel to the micro lens surfaces, which enables more compact image sensor dies usable in a lens module for an optimized spatial design and ease of miniaturization.