Abstract: A spindle motor is disclosed. The spindle motor includes a base including a PCB, a bearing housing installed on the base and having a bearing therein, a rotating shaft rotatably supported by the bearing, a stator including a core arranged around the bearing housing and a coil wound around the core, a rotor including a rotor yoke supported by the rotating shaft and a magnet coupled to the rotor yoke, and a stopper supported by the base at an outer side of the rotor yoke, and partially located above a portion of the rotor yoke to inhibit the rotor yoke from moving upward.
Abstract: The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package.
Type:
Grant
Filed:
May 16, 2006
Date of Patent:
March 23, 2010
Assignees:
LG Electronics Inc., LG Innotek Co., Ltd.
Abstract: A light emitting diode (LED) and a method for fabricating the same, capable of improving brightness by forming a InGaN layer having a low concentration of indium, and whose lattice constant is similar to that of an active layer of the LED, is provided. The LED includes: a buffer layer disposed on a sapphire substrate; a GaN layer disposed on the buffer layer; a doped GaN layer disposed on the GaN layer; a GaN layer having indium disposed on the GaN layer; an active layer disposed on the GaN layer having indium; and a P-type GaN disposed on the active layer. Here, an empirical formula of the GaN layer having indium is given by In(x)Ga(1-x)N and a range of x is given by 0<x<2, and a thickness of the GaN layer having indium is 50-200 ?.
Abstract: Provided are a semiconductor light emitting device and a method of fabricating the same. The semiconductor light emitting device comprises: a light emitting structure comprising a first conductive type semiconductor layer, an active layer under the first conductive type semiconductor layer, and a second conductive type semiconductor layer under the active layer; a reflective electrode layer under the light emitting structure, and an outer protection layer at an outer circumference of the reflective electrode layer.
Abstract: Provided is a flat type vibrating motor capable of reducing a consumed current of the motor while maintaining torque of the motor, lengthening even more an operating time of an apparatus such as a mobile communication apparatus in which the flat type vibrating motor is mounted, and shortening a charging period. At least one auxiliary coil separated at a predetermined mechanical degree with respect to a center of the primary coil mounted on the substrate, and series-connected to the primary coil is provided, so that a current flowing through the coil is reduced and torque equivalent to or greater than that of a related art motor can be obtained. Accordingly, an amount of a consumed current of the motor is reduced.
Abstract: Disclosed is a vibration motor. The vibration motor includes a bracket including a support tube protruding from the bracket, a case coupled with the bracket, a support shaft supported by the bracket and the case, a bearing rotatably fitted around the support shaft, a rotor fixed to the bearing to rotate together with the bearing, thereby generating vibration, a stator mounted on the bracket to rotate the rotor through interaction with the rotor, a support member installed around the support tube, and a first washer interposed between the support tube and the bearing and supported by the support member.
Abstract: A method of manufacturing a light emitting device is provided. An epitaxial layer is first formed at a plurality of separated regions on a substrate and a second electrode layer is formed on the epitaxial layer. Subsequently, the substrate is removed from the epitaxial layer and a first electrode layer is formed under the epitaxial layer, after which the second electrode layer is divided into chip units.
Abstract: Provided is a method of fabricating a nitride semiconductor light-emitting device comprising; providing a nitride semiconductor light-emitting device with a GaN layer, bringing the nitride semiconductor light-emitting device into contact with hydrogen separation metal, vibrating the nitride semiconductor light-emitting device and the hydrogen separation metal, removing hydrogen from the GaN layer of the nitride semiconductor light-emitting device and separating the hydrogen separation metal from the nitride semiconductor light-emitting device.
Abstract: Disclosed are a phosphor, method for preparing the same, and light emitting diode using the same. The method comprises the steps of preparing a precursor solution by mixing strontium nitrate (Sr(NO3)2), tetraethyl orthosilicate (TEOS), and europium oxide (Eu) with each other, forming a gel by heating the precursor solution, drying the gel specimen, performing calcination by removing water and organic materials from the dried gel, and preparing a phosphor by reducing the Eu of the gel.
Abstract: A lightening apparatus includes an LED (Light Emitting Diode) module having a plurality of LEDs and a connection terminal for supplying electric power, a diffusing guide for diffusing light emitted from the LEDs, and a cover in which the diffusing guide is installed and to which the LED module is coupled.
Abstract: A stepping motor includes a bracket, a housing having a first end coupled to the bracket and a second end having a reduced width compared with the first end, a stator disposed in the housing to form electric field, a first supporting unit formed on a first end of the bracket, a magnet fixed corresponding to the stator to provide the electric field, a second supporting unit supported on the second end of the housing, a rotor supported by the first and second supporting units, and a stopper fitted on an opened end of the second end of the housing to support the second supporting unit.
Abstract: A camera module, including a printed circuit board, an image sensor chip, and a housing, is provided. A plating line can be formed in an inner layer of the printed circuit board. A method of manufacturing the camera module can include connecting the plating line of the inner layer of the printed circuit board to a pattern of an outer layer using a via hole, performing a plating process, and forming an image sensor, the housing, and a lens part on the printed circuit board.
Abstract: Disclosed are a backlight unit and a display device having the same. The backlight unit comprises a light emitting diode (LED) module comprising an LED, a case supporting the LED module and comprising a bending part that guides and fixes an end portion of the LED module, and a fixing part fixing the LED module to the case.
Abstract: Disclosed is a light emitting device. The light emitting device comprises a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, the second conductive semiconductor layer comprising a first area and a second area, a third conductive semiconductor layer on the second area of the second conductive semiconductor layer, a first electrode layer electrically connecting the first conductive semiconductor layer with the second conductive semiconductor layer of the second area, and a second electrode layer electrically connecting the second conductive semiconductor layer with the third conductive semiconductor layer.
Abstract: A tuner and a demodulating unit thereof are provided. A trap filter for a specific frequency is installed in the IF demodulating unit so as to eliminate a frequency signal acting as a beat component.
Abstract: A flat vibration motor is provided. The flat vibration motor includes a rotor portion, a stator portion, a fixing mount, a pair of terminals, and a base portion. The rotor portion generates vibrating force when rotating. The stator portion houses and couples with the rotor portion to allow the rotor portion to rotate. The fixing mount extends from a side of a lower case of the stator portion. Each terminal includes a contacting portion, an elastic portion, and a joining portion. The base portion forms a plurality of supporting holes through which each of the terminals respectively passes. The joining portion of the terminal connects electrically to the circuit board through a peripheral lower surface around the supporting hole, when the base portion and the fixing mount are coupled.
Abstract: Embodiments of a linear vibrator are provided that are capable of reducing the manufacturing cost, increasing the product reliability and increasing the vibrating quantity. An embodiment of a linear vibrator can include a case formed of an upper case portion and a lower case portion coupled to each other to provide a predetermined inner space; a substrate disposed on an upper surface of the lower case portion; a first coil and a second coil installed at both end parts inside of the case and connected to the substrate; a spring having one side fixed on at least one of the inside faces of the case; and a magnet fixed at another side of the spring and located between the first and second coils inside of the case, where the magnet can vertically vibrate through an interaction with the first and second coils.
Abstract: A nitride-based light emitting device capable of achieving an enhancement in emission efficiency and an enhancement in reliability is disclosed. The light emitting device includes a semiconductor layer, and a light extracting layer arranged on the semiconductor layer and made of a material having a refractive index equal to or higher than a reflective index of the semiconductor layer.
Type:
Grant
Filed:
May 7, 2007
Date of Patent:
January 26, 2010
Assignees:
LG Innotek Co., Ltd., LG Electronics Inc.
Inventors:
Hyun Kyong Cho, Sun Kyung Kim, Jun Ho Jang
Abstract: A semiconductor light emitting device package according to an embodiment comprising: a package body comprising a groove section; an electrode in the groove section; at least one semiconductor light emitting device electrically connected to the electrode in the groove section of the package body; an interconnection pattern on an outer peripheral surface of the package body and electrically connected to the electrode, wherein a part of the interconnection pattern is on a bottom surface of the package body; and a metal pattern is on the bottom surface of the package body corresponding to an area in which the semiconductor light emitting device is located.