Patents Assigned to Innovatier Inc.
  • Embedded electronic device and method for manufacturing an embedded electronic device
    Patent number: 8727224
    Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: May 20, 2014
    Assignee: Innovatier, Inc.
    Inventor: Robert Singleton
  • Pre-lamination core and method for making a pre-lamination core for electronic cards and tags
    Patent number: 8657983
    Abstract: The disclosed pre-lamination core and the method of making such a pre-lamination core includes an electronic component or a non-electronic component, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The pre-lamination core can be used in the manufacture of cards while using conventional equipment to apply top and bottom overlays to the pre-lamination core.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: February 25, 2014
    Assignee: Innovatier, Inc.
    Inventor: Robert Singleton
  • EMBEDDED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING AN EMBEDDED ELECTRONIC DEVICE
    Publication number: 20130284815
    Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
    Type: Application
    Filed: April 2, 2013
    Publication date: October 31, 2013
    Applicant: Innovatier, Inc.
    Inventor: Innovatier, Inc.
  • Electronic inlay module used for electronic cards and tags
    Patent number: 7959085
    Abstract: The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: June 14, 2011
    Assignee: Innovatier, Inc.
    Inventor: Robert W. Singleton
  • RFID bracelet and method for manufacturing a RFID bracelet
    Patent number: 7607249
    Abstract: A RFID bracelet and a method for manufacturing the same wherein the bracelet is composed of a bottom layer having a top surface and a bottom surface, a radio frequency identification microprocessor attached to the top surface of the bottom layer, an antenna, operably coupled to the radio frequency identification microprocessor and attached to the top surface of the bottom layer, a core layer, positioned above the bottom layer and attached to the bottom layer, the radio frequency identification microprocessor and the antenna and a top layer, positioned above the core layer and attached to the core layer.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: October 27, 2009
    Assignee: Innovatier Inc.
    Inventor: Robert Singleton