Patents Assigned to Innovative Packing Technology
  • Refurbishing of prior used laminated ceramic packages
    Patent number: 4914813
    Abstract: The invention is directed to a process for refurbishing of prior used laminated ceramic packages with the example shown as a pin grid array ceramic package which includes a ceramic substrate with a central opening or cavity, a plurality of conductors are embedded therein in one or more layers which have electrical condtinuity from the outer edge thereof to the central opening (this continuity path may extend through one or more layers) and to an equal plurality of conductive pads on the surface of the substrate.
    Type: Grant
    Filed: November 25, 1988
    Date of Patent: April 10, 1990
    Assignee: Innovative Packing Technology
    Inventors: Francis W. Layher, Napoleon Fulinara