Abstract: A fixture for supporting printed circuit (PC) boards during wave soldering includes a rigid frame having a ledge formed along the inner perimeter of the frame. The ledge supports a PC board along a peripheral portion of the board. Channels are formed atop the frame for receiving slidably removable clamps. The fixture further includes a slidably removable rail coupled to the frame along its channels. The rail includes a ledge that is coplanar with the ledge of the frame. The rail can be adjusted to provide support for smaller PC boards. A drop-plate component includes a recessed area for receiving a PC board, and depressed regions for masking components on the board. Openings formed in the drop-plate expose desired areas of the board for soldering. The drop-plate, loaded with a PC board, fits into the frame along the ledges of the frame and/or the rail for a wave soldering operation.