Abstract: A waveguide is disclosed that shifts the phase of the signal passing through it. In one embodiment, the waveguide has an impedance structure on its walls that resonates at a frequency lower than the frequency of the signal passing through the waveguide. This causes the structure to present a capacitive impedance to the signal, increasing its propagation constant and shifting its phase. Another embodiment of the new waveguide has impedance structures on its wall that are voltage controlled to change the frequency at which the impedance structures resonate. The range of frequencies at which the structure can resonate is below the frequency of the signal passing through the waveguide. This allows the waveguide cause a adjust the shift in the phase of its signal. An amplifier array can be included in the waveguides to amplify the signal. A module can be constructed of the new waveguides and placed in the path of a millimeter beam.

Abstract: An improved waveguide wall structure and improved waveguide using the new wall structure as the interior walls of the waveguide. The wall structure comprises a sheet of dielectric material, a series of parallel conductive strips on one side of the dielectric material and a layer of conductive material on the other side. Multiple conductive vias are also included through the dielectric material and between the conductive layer and conductive strips. The new wall structure presents as a series of parallel L-C circuits to a transverse E field at resonant frequency, resulting in a high impedance surface. The wall structure can be used in waveguides that transmit a signal in one polarization or signals that are cross polarized. The new waveguide maintains a near uniform density E field and H field component, resulting in near uniform signal power density across the waveguide cross section.

Abstract: Light emitters are formed and patterned on an electrode for an organic light-emitting device by electrochemically polymerizing a monomer across the full length of the electrode. A second electrode is deposited so to define a pixel region between mutually aligned portions of the two electrodes. Electroluminescence of the emitter occurs when a voltage is applied across the electrodes of the device.

Abstract: A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material. Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques. Drive electronics are mounted to the layers of structural and sacrificial material. The handle layer is removed to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved. The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer being adjacent to a Si mirror layer. The surface micomachining layers form electrode and spring structures.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A new cell assembly for semiconductor wafer electroplating in the plated-side-up configuration utilizes a narrow passageway around the perimeter of the wafer through which solution is forced so as to provide the laminar flow needed for effective Damascene copper plating. In addition, use of a cylindrical insulating cell wall whose inside diameter matches that of the wafer area being plated avoids overplating of the wafer periphery. Anode isolation in a compartment separated via a solution transport barrier prevents introduction of particulates and holds anolyte in place during wafer changes. This cell assembly is readily amendable to automated wafer plating.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: The present invention is a reversible electrodeposition optical modulation device employing an ionic liquid electrolyte, which is comprised of a mixture of an ionic organic compound and the salt of an electrodepositable metal. The solventless ionic liquid can contain very high concentrations of electrodepositable metal ions and provides the high current carrying capability needed for fast device switching. Switching uniformity is also significantly improved since the electrolyte resistance is at least an order of magnitude higher than that of typical solvent-based electrolytes. Fast switching and good cycle life for high quality mirror electrodeposits in reversible electrochemical mirror (REM) devices was demonstrated. Best results were obtained for novel silver halide electrolytes employing pyrrolidinium and N-methylpyrrolidinium cations.

Abstract: A converter and rectifier circuit comprises a magnetic core, a first secondary winding, a second secondary winding, a third secondary winding, a first rectifier, a second rectifier and an output capacitor. The first, second and third secondary windings are wound around the magnetic core and are connected to each other. The first rectifier is connected to the first secondary winding and the second rectifier is connected to the second secondary winding. The output capacitor is connected to the first and second rectifiers and is connected in series with the third secondary winding.

Abstract: An embedded real time diagnostic system that is applicable to fault detection and isolation in host systems having repetitive subsystems. A query directed acyclic graph (Q-DAG) for one of each type of repetitive subsystem is compiled off-line from a causal network model and is stored in host system computer memory. When a fault in the host system is detected by the computer, a replicating program replicates the necessary subsystem Q-DAGs to construct an overall host system Q-DAG. A data table which contains information on how the various Q-DAGs are linked based on the hardware architecture of the host system, is also accessed by the computer. The data table contains a matrix which dictates which Q-DAGs are linked, and Q-DAG level information on the Q-DAG nodes and which nodes are linked to nodes in other Q-DAGs. The new diagnostic system uses less memory and processor throughput while still providing full system diagnostics.

Abstract: An apparatus and method monitors the condition of a bearing/shaft assembly by forming diagnostics based on spectral analysis of assembly's vibration. Baseline parameters are determined by a microprocessor analysis of the vibration spectra, comparing actual peaks to the peaks predicted by a model. The microprocessor estimates rotation rate and preferably number of rolling elements by attempting to fit the model to the actual vibrational spectrum, by varying the assumptions. Baseline profiles are formed from one or more selected tones and preferably also harmonics thereof, to characterize the bearing/shaft assembly. The baseline profiles and parameters are compared against later acquired vibrational characteristics, and the comparison is used to diagnose bearing and/or shaft conditions.

Abstract: A method of directly fabricating metal parts with surface features only requires first preparing a mold of the desired metal part. A powder blend is poured into the mold, which includes a base metal, a lower melting temperature alloy of the base metal, and a polymer binder. The mold containing the powder blend is heated until the polymer binder melts and adheres the metal particles to form a green part. The green part is removed from the mold and placed in a crucible, and loose ceramic powder is packed around the part to support it. The supported green part is then heated as needed to vaporize the binder and consolidate the part via liquid phase sintering. Once cool, the consolidated part can be machined to meet precise dimensional tolerances, if necessary.

Abstract: An apparatus and method for ink jet printing on textiles is disclosed, wherein the steps of pre-treating, ink jet printing, and post-treating the textile takes place at the ink jet printer. A preferred method includes the steps of applying a pre-treat to the textile, evaporating excess water from the pre-treat, ink jet printing a pattern on the pre-treated textile, evaporating water from the ink in the pattern, applying a binder/post-treat to the pattern and curing the binder. The textile printing apparatus prints on an untreated textile by having a first application device to apply a pre-treat aqueous solution to the textile. A first heating element is arranged to evaporate most or all of the water from the pre-treated textile as it passes. An ink jet printer then accepts the pre-treated textile and prints the desired pattern on it. A second heating element at the output of the printer evaporates water from the ink in the pattern as the printed textile passes.

Abstract: A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material. Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques. Drive electronics are mounted to the layers of structural and sacrificial material. The handle layer is removed to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved. The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer being adjacent to a Si mirror layer. The surface micomachining layers form electrode and spring structures.

Abstract: A direct displacement plating process provides a uniform, adherent coating of a relatively stable metal (e.g., nickel) on a highly reactive metal (e.g., aluminum) that is normally covered with a recalcitrant oxide layer. The displacement reaction proceeds, preferably in a nonaqueous solvent, as the oxide layer is dissolved by a fluoride activator. Halide anions are used to provide high solubility, to serve as an anhydrous source of stable metal ions, and to control the rate of the displacement reaction. A low concentration of activator species and little or no solution agitation are used to cause depletion of the activator species within pores in the surface oxide so that attack of the reactive metal substrate is minimized. Used in conjunction with electroless nickel deposition to thicken the displacement coating, this process can be used to render aluminum pads on IC chips solderable without the need for expensive masks and vacuum deposition operations.

Abstract: A laser-based technique to determine glass thickness employs a pulsed laser to induce an ultrasonic wave between the surfaces of a region of glass, causing the surfaces to move in and out at a characteristic frequency. The surface motion is monitored to determine the characteristic frequency, which is proportional to the thickness of the glass in the region of the ultrasonic wave. The pulsed laser produces a short duration pulse that illuminates a surface of the glass, which is absorbed within the glass to cause a rapid thermal expansion that generates the ultrasonic wave. The surface motion induced by the ultrasonic wave is preferably detected with a laser interferometer system, the output of which is analyzed to determine the surface motion's characteristic frequency.

Abstract: A photodetector sensitive to ultraviolet wavelengths is capable of single photon sensitivity at room temperatures and video frame rates. It includes (a) a compound semiconductor photodiode, biased below its avalanche breakdown threshold, comprising III-V elemental components and having a bandgap with transition energy higher than the energy of visible photons; and (b) a high input impedance MOS interface circuit, arranged to receive a signal from the photodiode junction and to amplify said signal. Preferably, the photodiode junction is integrated in a first microstructure on a first substrate, and its interface circuit in a second microstructure on a second substrate. Both microstructures are then joined in a laminar, sandwich-like structure and communicate via electrically conducting contacts.

Abstract: A photodetector sensitive to visible and shorter wavelengths is capable of single photon sensitivity at room temperatures and video frame rates. It includes (a) a compound semiconductor photodiode, biased below its avalanche breakdown threshold, comprising III-V elemental components and having a bandgap with transition energy higher than the energy of infrared photons; and (b) a high trans-impedance interface circuit, arranged to receive a signal from the photodiode junction and to amplify said signal. Preferably, the photodiode junction is integrated in a first microstructure on a first substrate, and its interface circuit in a second microstructure on a second substrate. Both microstructures are then joined in a laminar, sandwich-like structure and communicate via electrically conducting contacts.

Abstract: An electrical exciting circuit produces a plurality of oscillating electrical excitations, each at an independently controllable frequency. A set of drive electrodes are distributed in an array, and connected so that each receives a respective one of the excitations. A dual frequency liquid crystal (DFLC) material is arranged in the path of a coherent light beam and is disposed in proximity to the set of drive electrodes so as to receive electrical excitations. The DFLC has a dielectric coefficient which varies locally in relation to the frequency of the local electrical excitation received. The voltages and at least two frequencies of the excitations are controlled so as to produce a desired profile of the dielectric coefficient (for at least one polarization) and a corresponding optical phase delay profile for the coherent beam. Preferably, a novel reflective groundplane is included to improve optical reflective efficiency.

Abstract: A method and apparatus three-dimensionally images a subject scene by first illuminating it with a laser pulse, then receiving reflected light from the scene using an optical system and a pixellated array or photodetectors operating in a linear mode. The distances to the various surfaces in the scene are determined by determining the relative times of arrival of the reflected photons at each pixel on the photodetector array. Based on the light detected and its time of arrival at each pixel, a three dimensional image is constructed and displayed. High sensitivity photodetectors operating in a linear, non-geiger mode are preferably integrated with a high-gain, fast charge amplifier and a timing circuit at each pixel, enabling image acquisition in as few as one pulse. A multi-pulse embodiment allows more accurate “vernier” depth measurement, with a small number of pulses.