Patents Assigned to Innovia Fillms Limited
  • Patent number: 8071188
    Abstract: The present invention concerns a sealed package formed from a polymer film comprising a block copolymeric substrate and a heat sealable coating and/or skin layer on the substrate, the package being formed by wrapping the film around an article to be packaged in a manner to obtain at least one region of film overlap, and heat sealing the resulting overlapped film sections to each other to provide at least one sealed region of the package, the sealed region being subsequently openable by manually separating the overlapped film sections, effective without substantial tearing of the film at or around the sealed region.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: December 6, 2011
    Assignee: Innovia Fillms Limited
    Inventor: Shalendra Singh