Abstract: A method for forming a composite substrate containing layers of dissimilar materials is provided. The method includes a step of disposing a release layer over a base substrate where the base substrate is composed of a first material. A template layer is attached to the release layer. Characteristically, the template layer is composed of a second material and adapted to form a compound semiconductor device thereon.
Type:
Application
Filed:
July 26, 2021
Publication date:
January 27, 2022
Applicants:
UNIVERSITY OF SOUTHERN CALIFORNIA, CALIFORNIIA INSTITUTE OF TECHNOLOGY, InPi, LLC
Inventors:
Rehan Rashid KAPADIA, Khaled AHMED, Frank GREER