Patents Assigned to InPi, LLC
  • Publication number: 20220028907
    Abstract: A method for forming a composite substrate containing layers of dissimilar materials is provided. The method includes a step of disposing a release layer over a base substrate where the base substrate is composed of a first material. A template layer is attached to the release layer. Characteristically, the template layer is composed of a second material and adapted to form a compound semiconductor device thereon.
    Type: Application
    Filed: July 26, 2021
    Publication date: January 27, 2022
    Applicants: UNIVERSITY OF SOUTHERN CALIFORNIA, CALIFORNIIA INSTITUTE OF TECHNOLOGY, InPi, LLC
    Inventors: Rehan Rashid KAPADIA, Khaled AHMED, Frank GREER