Abstract: The invention relates to using VLSI techniques to store information on a substrate. One embodiment of a die with text deposited upon the die uses semiconductor processing techniques during fabrication. Included in the die are a substrate, a first paragraph and a second paragraph. The first and second paragraphs are in contact with the substrate. The second paragraph is aligned with the first paragraph in a column.
Type:
Application
Filed:
December 3, 2003
Publication date:
December 9, 2004
Applicant:
Inscript, LLC
Inventors:
Pawan Sinha, Pamela R. Lipson, Keith R. Kluender
Abstract: The invention relates to using VLSI techniques to store information on a substrate. One embodiment of a die with text deposited upon the die uses semiconductor processing techniques during fabrication. Included in the die are a substrate, a first paragraph and a second paragraph. The first and second paragraphs are in contact with the substrate. The second paragraph is aligned with the first paragraph in a column.
Type:
Grant
Filed:
September 15, 2000
Date of Patent:
January 20, 2004
Assignee:
Inscript, LLC
Inventors:
Pawan Sinha, Pamela R. Lipson, Keith R. Kluender