Patents Assigned to Inscript, LLC
  • Publication number: 20040250233
    Abstract: The invention relates to using VLSI techniques to store information on a substrate. One embodiment of a die with text deposited upon the die uses semiconductor processing techniques during fabrication. Included in the die are a substrate, a first paragraph and a second paragraph. The first and second paragraphs are in contact with the substrate. The second paragraph is aligned with the first paragraph in a column.
    Type: Application
    Filed: December 3, 2003
    Publication date: December 9, 2004
    Applicant: Inscript, LLC
    Inventors: Pawan Sinha, Pamela R. Lipson, Keith R. Kluender
  • Patent number: 6680162
    Abstract: The invention relates to using VLSI techniques to store information on a substrate. One embodiment of a die with text deposited upon the die uses semiconductor processing techniques during fabrication. Included in the die are a substrate, a first paragraph and a second paragraph. The first and second paragraphs are in contact with the substrate. The second paragraph is aligned with the first paragraph in a column.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: January 20, 2004
    Assignee: Inscript, LLC
    Inventors: Pawan Sinha, Pamela R. Lipson, Keith R. Kluender