Abstract: A metrology method in accordance with at least some embodiments of the present technology includes receiving images of first and second alignment elements of an integrated circuit. The first and second alignment elements are, respectively, at a first level and an overlying second level of the integrated circuit. The method also includes analyzing the images to determine respective blended approximate centerpoints of the first and second alignment elements. For each of the first and second alignment elements, this analysis is based, at least partially, on two or more different 90-degree rotational symmetries. The method further includes determining an overlay offset of the second level relative to the first level based, at least partially, a difference between the blended approximate centerpoint of the first alignment element and the blended approximate centerpoint of the second alignment element.