Patents Assigned to INSTITUT VEDECOM
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Patent number: 11664739Abstract: In brief, the invention relates in particular to a converter (100) comprising a plurality of rectifier arms (110), making it possible in particular to rectify AC electrical signals available on the electrical phases (U, V, W) of an electrical grid. To balance the electrical signals coming from the electrical phases (U, V, W) of the electrical grid, and to limit a modulation amplitude of the DC signal generated by the converter (100) between its output terminals (S1, S2), the converter (100) also comprises a correction arm (120) that determines an amplitude of electric current flowing in a neutral (N) of the electrical grid and that generates an opposing electric current of equal or if not close amplitude. The invention also relates to a two-way charger (10) comprising such a converter (100) and one or more active double bridges (200), such that an output (S3, S4) of the active double bridges (200) is electrically isolated from the converter (100).Type: GrantFiled: March 28, 2019Date of Patent: May 30, 2023Assignee: INSTITUT VEDECOMInventors: Mustapha Debbou, David Frey, Nisith Bhowmick, François Colet, Seddik Bacha
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Patent number: 11255971Abstract: The present invention relates to an optical telemetry system for measuring the distance between two vehicles comprising a first optoelectronic assembly formed by at least one light source SLs and at least one photosensitive sensor CP+, which source and sensor are oriented towards in front of the vehicle, and a second optoelectronic assembly formed by at least one light source SLc (6) and at least one photosensitive sensor CPc (5) that is oriented towards behind the vehicle, characterized in that said light sources SLs and SLc are conventional light sources, the light source SLs being modulated by a signal of frequency Fs, said light source SLc (6) of the target (4) being modulated by a clock of frequency controlled by a phase-locked loop driven by the electrical signal delivered by said photosensitive sensor CPc, said first optoelectronic assembly furthermore comprising a circuit for measuring the phase shift between the electrical signal delivered by said photosensitive sensor CPs (5) and the signal modulatiType: GrantFiled: May 10, 2017Date of Patent: February 22, 2022Assignees: INSTITUT VEDECOM, UNIVERSITE VERSAILLES SAINT-QUENTIN-EN-YVELINESInventors: Bastien Bechadergue, Luc Chassagne, Hongyu Guan
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Patent number: 11177139Abstract: The electronic card with printed circuit (1) comprises at least one antenna with slots (AT) including a cavity (15) and a metal conductive layer (17) covering the cavity and having a plurality of slots (S17). The slots form openings in the metal conductive layer. In accordance with the invention, the cavity is formed, by removal of material, in the thickness of the printed circuit. The cavity also comprises a metallisation layer (16) on the walls and the metal conductive layer is formed in a plate attached on the electronic card with printed circuit and closes the cavity.Type: GrantFiled: January 29, 2018Date of Patent: November 16, 2021Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 11108291Abstract: The invention relates to a flange (1) for an electrical machine (100), said flange being configured to at least partially cover winding overhangs (10) that form part of the electrical machine (100), the flange (1) comprising a chamber (5) able to receive a cooling fluid, characterized in that the flange (1) comprises at least one first orifice and at least one second orifice allowing cooling fluid to enter the chamber (5) or allowing cooling fluid to leave the chamber (5), said chamber (5) having a profile that compliments that of at least one winding overhang (10). Said invention is applicable to motor vehicles.Type: GrantFiled: May 9, 2017Date of Patent: August 31, 2021Assignee: INSTITUT VEDECOMInventors: Tahar Hamiti, Guy Diemusch, Dominique Lhotellier
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Patent number: 11094618Abstract: The invention relates to a modular element (2) comprising a stratification of first and second electroconductive plates (PH2, PB2) which are separated by an intermediate dielectric layer (CD2) and at least one electronic power switching chip (CP1, CP2) which is implanted between the first and second plates, the chip having a upper face comprising a first power electrode and a switching control electrode and a lower face comprising a second power electrode, and the first and second power electrodes being in electrical continuity respectively with the first and second plates.Type: GrantFiled: March 29, 2019Date of Patent: August 17, 2021Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 11081970Abstract: The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (S1 to S6) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (B11 to B16) and at least one internal portion of bus bar (B21 to B26, B31 to B36) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as “press pack”.Type: GrantFiled: February 22, 2019Date of Patent: August 3, 2021Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 11032951Abstract: The invention relates to a three-dimensional electronic module comprising an electronic device housed between a first substrate and a second substrate, said first and second substrates being electrically and/or thermally connected to one another by at least one and preferably two heat bridges added onto and rigidly connected to said first and second substrates. The invention also relates to an electronic system comprising at least two electronic modules mounted facing one another so as to sandwich a third substrate in contact with the second substrate thereof, respectively. The third substrate is configured to provide thermal and electrical coupling between the two electronic modules via the second substrate (140) thereof.Type: GrantFiled: November 15, 2018Date of Patent: June 8, 2021Assignee: INSTITUT VEDECOMInventors: Hadi Alawieh, Menouar Ameziani
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Patent number: 10994677Abstract: The invention relates to a busbar (1) arranged so as to electrically connect at least one power electronic module (13) from at least one electrical conductor (6) to which the busbar (1) can be connected. The busbar (1) comprises a plurality of coaxial sleeves (2). Each of the sleeves (2) comprises a plurality of arms (4) that are distributed peripherally and radially around an axis (A) of the sleeves (2). The arms (4) extend longitudinally in parallel to the axis (A) and each include at least one conductive track (5) forming one of the buses of the busbar (1). The invention also relates to a power electronic module incorporating a busbar in accordance with the invention, and to a vehicle fitted with said module.Type: GrantFiled: March 1, 2017Date of Patent: May 4, 2021Assignee: INSTITUT VEDECOMInventor: Guy Diemunsch
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Patent number: 10998831Abstract: The power module comprises an electronic board (EB), in which at least one power switching branch is integrated, a capacitor (CE) and at least three DC power supply busbars (B1, B2, B3), wherein the electronic board is mounted between a first busbar (B1) and a second busbar (B2) and the capacitor is mounted between the second busbar (B2) and a third busbar (B3) and the electronic board, the capacitor and the busbars comprise electric contact faces allowing assembly, of the “press pack” type, of the electronic board and of the capacitor.Type: GrantFiled: February 22, 2019Date of Patent: May 4, 2021Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 10978930Abstract: The invention relates to a sleeve (1) providing a mechanical connection between a shaft of an electrical machine and a rotational bearing of the electrical machine (100) comprising: —a first portion (3) arranged to co-operate with the electrical machine shaft, —a second portion (5) arranged to co-operate with the rotational bearing, characterized in that the first portion (3) defines at least one internal chamber (4) and comprises at least one means of communication (6) between an environment surrounding the sleeve (1) and the internal chamber (4). Said invention is applicable to motor vehicles.Type: GrantFiled: September 6, 2017Date of Patent: April 13, 2021Assignee: INSTITUT VEDECOMInventor: Guy Diemunsch
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Patent number: 10950513Abstract: The method comprises the steps of 1) producing first and second blanks (EB1, EB2) by laminating insulating and conductive inner layers (PP, CP, E1) on copper plates forming a base (MB1, MB2), at least one electronic chip (MT, MD) being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.Type: GrantFiled: December 5, 2017Date of Patent: March 16, 2021Assignees: INSTITUT VEDECOM, ELVIA PCBInventors: Friedbald Kiel, Olivier Belnoue
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Patent number: 10912191Abstract: The electronic card with printed circuit comprises at least one diffraction structure (DS) having a cavity (15) and a diffraction plate (17). In accordance with the invention, the diffraction structure is incorporated in the thickness of the electronic card with printed circuit, the cavity being formed, by removal of material, in the thickness of the electronic card with printed circuit and the diffraction plate being formed in a plate which is arranged on the electronic card with printed circuit and closes the cavity.Type: GrantFiled: January 30, 2018Date of Patent: February 2, 2021Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 10818605Abstract: The circuit comprises at least one electronic chip (MT, MD), a laminated substrate and heat sink means, the chip being implanted in the substrate and the heat sink means being secured to opposing faces of the substrate. According to the invention, the heat sink means comprise heat-sink-forming bus-bars (BBH, BBL) mounted on the opposing faces of the substrate, each of said bus-bars being formed by a plurality of metal segments (BB1H, BB2H, BB3H, BB4H; BB1L, BB2L, BB3L) secured at spaced-apart positions and interconnected with one another and with a contact face of the electronic chip (MT, MD) by means of a metal layer (MEH, MEL).Type: GrantFiled: December 6, 2017Date of Patent: October 27, 2020Assignees: INSTITUT VEDECOM, ELVIA PCBInventors: Friedbald Kiel, Olivier Belnoue
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Publication number: 20200331495Abstract: The present invention relates to a system for steering an autonomous vehicle comprising a plurality of sensors (1 to 6) of different natures, calculators executing computer programs for determining items of information regarding delegated driving as a function of the data delivered by said sensors, characterized in that it furthermore comprises at least one arbitration module (15) comprising at least one calculator executing a computer program to decide the safest functional selection of one of said items of information regarding delegated driving as a function of a plurality of items of information calculated as a function: ? of dynamic data comprising part at least of the items of information consisting of: ? confidence levels (44) of each of said items of information of delegated driving, ? of the coherence (45) of variables associated with said delegated items of information ? of the hardware and software reliability (46) of the components of said system ? of climatic and/or historical data comprising parType: ApplicationFiled: July 25, 2017Publication date: October 22, 2020Applicant: Institut VedecomInventor: Annie BRACQUEMOND
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Patent number: 10804183Abstract: The method for producing a preform integrating at least one electronic chip included between insulating and/or conductive laminated internal layers; mechanically securing metal bus-bar segments at given spaced-apart positions on opposing upper and lower faces of the preform, using dielectric portions of a resin prepreg; and for each of the upper and lower opposing faces, electrodepositing a metal layer in order to interconnect bus-bar segments secured to the face in question and an electrode of the electronic chip, thereby forming an electronic power circuit comprising bus-bars forming heat sinks.Type: GrantFiled: December 6, 2017Date of Patent: October 13, 2020Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 10790726Abstract: The invention relates to an assembly (1000) comprising an electrical machine (100) comprising: a stator (9) having windings forming coils (106), a rotor (103), a shaft (101) rotating the rotor (103), and an impeller (1) for cooling the electrical machine, said cooling impeller (1) comprising at least two crowns (2, 21, 22), including a first crown (21) and a second crown (22), each crown (2, 21, 22) comprising blades (3), the blades (3, 31) of the first crown (21) of the cooling impeller (1) being arranged so as to generate the circulation of a cooling fluid flow in a first direction (F1), and the blades (3, 32) of the second crown (22) being arranged so as to generate the circulation of the cooling fluid flow in a second direction (F2), the second direction (F2) opposing the first direction (F1). Said invention is applicable to motor vehicles.Type: GrantFiled: September 19, 2017Date of Patent: September 29, 2020Assignee: INSTITUT VEDECOMInventor: Guy Diemunsch
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Patent number: 10734361Abstract: The power switching module includes first and second subassemblies that are superimposed on top of each other to form a stack and that comprise first and second electronic power switches forming a bridging arm, respectively. The module comprises a metal central sheet (LW7) and first and second metal end sheets (LW2, LW12) forming top and bottom ends of the stack. According to the invention, the module also comprises first, second and third metal terminal rods (1, 2, 3) that extend through the stack and open onto at least one of the top and bottom ends thereof, the first, second and third rods being in electrical continuity with the first and second metal end sheets and the metal central sheet, respectively.Type: GrantFiled: December 5, 2017Date of Patent: August 4, 2020Assignees: INSTITUT VEDECOM, ELVIA PCBInventors: Friedbald Kiel, Olivier Belnoue
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Patent number: 10734368Abstract: The method comprises the steps of 1) producing first and second blanks (EB1) including reserved-space defining means (HM1, HM2), by laminating insulating and conductive inner layers (PP, CP) on copper plates forming a base (MB1), at least one electronic chip being sandwiched between the blanks, said blanks being produced such that their upper lamination surfaces have matching profiles, 2) stacking and fitting the blanks via their matching profiles, and 3) press-fitting the blanks to form a laminated sub-assembly for an integrated power electronics device. The method uses IMS-type techniques.Type: GrantFiled: December 5, 2017Date of Patent: August 4, 2020Assignee: INSTITUT VEDECOMInventor: Friedbald Kiel
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Patent number: 10714406Abstract: The module (PM1) has an architecture with 3D stacking of the electronic power switching chips (IT, ID) and comprises first and second dielectric substrates (SH, SL) that are intended to come into thermal contact with first and second heat sinks (DH, DL), respectively, at least one pair of first and second stacked electronic power switching chips (ITHS, IDHS; ITHS, IDHS) and a common intermediate substrate (SC), the first and second electronic power switching chips being sandwiched between the first dielectric substrate and the common intermediate substrate and between the common intermediate substrate and the second dielectric substrate, respectively. According to the invention, the common intermediate substrate is a metal element formed as a single piece and comprises a central portion for the implantation of the electronic power switching chips and at least one.Type: GrantFiled: April 9, 2018Date of Patent: July 14, 2020Assignee: INSTITUT VEDECOMInventors: Hadi Alawieh, Menouar Ameziani
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Patent number: 10688860Abstract: The invention relates to a motorised vehicle (10) comprising (i) an electric motor (130) situated in an engine compartment (11), the said electric motor (130) being designed to propel the vehicle (10), (ii) a cabin (12) of the vehicle (10), separated from the engine compartment (11) by a dividing wall (70), (iii) an energy storage device (23) configured to supply electrical power to the electric motor (130), (iv) a power module (110) designed to shape at least one electric power signal configured to power the electric motor (130), the said power module (110) being situated between the electric motor (130) and the cabin (12).Type: GrantFiled: March 8, 2017Date of Patent: June 23, 2020Assignee: INSTITUT VEDECOMInventor: Guy Diemunsch