Abstract: Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus may include: a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and a first tube, through which the cooling plates are connected, allowing the flow channels of the cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube.

Abstract: A hot-press sintering method to prepare a loop heat pipe evaporator includes: putting a shell of the evaporator into a mould, uniformly and compactly filling corresponding positions in the mould with material powders of an evaporation core, a heat insulation core and a transmission core, applying a pressure high enough to tightly fit the evaporation core and the transmission core to the shell at corresponding sintering temperatures of powder materials for the evaporation core and the transmission core, carrying out hot-press sintering for molding, carrying out cooling after metallurgically bonding the powder materials of the evaporation core and the transmission core, and carrying out demolding to obtain the loop heat pipe evaporator, wherein the mould is provided with corresponding structures shaped like steam channels on positions where the evaporation core is provided with the steam channels.