Patents Assigned to INSTITUTO ATLANTICO
  • Patent number: 11971689
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: April 30, 2024
    Assignees: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Patent number: 11726449
    Abstract: According to examples, an apparatus may include a processor and a memory on which is stored machine readable instructions that when executed by the processor are to cause the processor to access a reduced resolution three-dimensional (3D) model file of an object to be built in a build bed of a 3D printing system, the reduced resolution 3D model file comprising a reduced resolution file of a first resolution 3D model file of the object. The instructions may also cause the processor to determine a packing arrangement for the object and a plurality of other objects to be built in the build bed through use of the reduced resolution 3D model file and output the determined packing arrangement for the 3D printing system to print the object and the other objects.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: August 15, 2023
    Assignees: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Thiago Barbosa Lima De Moura, Alyne Gomes Soares Cantal, Ana Patricia Del Angel, Jun Zeng, Scott A White, Sebastia Cortes i Herms
  • Patent number: 11511492
    Abstract: A method of manufacturing an object via three-dimensional printing is disclosed. Data regarding the object is received. The object is three-dimensionally printed from the data. A wrapper is also three-dimensionally printed from the data. The wrapper encloses the object and includes information regarding the object.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: November 29, 2022
    Assignees: Instituto Atlântico, Hewlett-Packard Development Company, L.P.
    Inventors: Marcelo Aita Riss, Thiago B. Lima de Moura, Alyne Gomes Soares Cantal, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes i Herms
  • Patent number: 11420396
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include fabrication components and a controller. The controller may control the fabrication components to fabricate parts of a 3D object in a build envelope, the parts to be assembled together to form the object, and in which the parts are fabricated at locations corresponding to relative positions of the parts with respect to each other in the assembled object. The controller may also control the fabrication components to fabricate a cage around the parts in the build envelope.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 23, 2022
    Assignees: Hewlett-Packard Development Co., L.P., Instituto Atlantico
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, Thiago Barbosa Lima De Moura, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes I Herms
  • Publication number: 20210349428
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Application
    Filed: December 12, 2018
    Publication date: November 11, 2021
    Applicants: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Publication number: 20210342211
    Abstract: Examples of methods for fault prediction model training with audio data are described herein. In some examples, service event data and audio data corresponding to client devices are received. In some examples, a portion of the audio data is selected based on the service event data. In some examples, a machine learning model is trained for fault prediction based on the portion of audio data.
    Type: Application
    Filed: January 21, 2019
    Publication date: November 4, 2021
    Applicants: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Tiago Barbosa Melo, Claudio Andre Heckler
  • Publication number: 20210197489
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include fabrication components and a controller. The controller may control the fabrication components to fabricate parts of a 3D object in a build envelope, the parts to be assembled together to form the object, and in which the parts are fabricated at locations corresponding to relative positions of the parts with respect to each other in the assembled object. The controller may also control the fabrication components to fabricate a cage around the parts in the build envelope.
    Type: Application
    Filed: October 31, 2017
    Publication date: July 1, 2021
    Applicants: Hewlett-Packard Development Company, L.P., Instituto Atlåntico
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, Thiago Barbosa Lima De Moura, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes I Herms
  • Publication number: 20200379436
    Abstract: According to examples, an apparatus may include a processor and a memory on which is stored machine readable instructions that when executed by the processor are to cause the processor to access a reduced resolution three-dimensional (3D) model file of an object to be built in a build bed of a 3D printing system, the reduced resolution 3D model file comprising a reduced resolution file of a first resolution 3D model file of the object. The instructions may also cause the processor to determine a packing arrangement for the object and a plurality of other objects to be built in the build bed through use of the reduced resolution 3D model file and output the determined packing arrangement for the 3D printing system to print the object and the other objects.
    Type: Application
    Filed: February 19, 2018
    Publication date: December 3, 2020
    Applicants: INSTITUTO ATLANTICO, HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Marcelo Aita Riss, Thiago Barbosa Lima De Moura, Alyne Gomes Soares Cantal, Ana Patricia Del Angel, Jun Zeng, Scott A White, Sebastia Cortes I Herms
  • Publication number: 20200223145
    Abstract: An image processing system acquires a first three-dimensional model of an object. The image processing system includes a processor and storage medium encoded with instructions executable by the processor. The instructions include instructions to define a material potential function for a material. The material potential function is a function of a three-dimensional origin point of the material in the object, a three-dimensional propagation limit of the material in the object, and a three-dimensional propagation function of the material in the object. The instructions include instructions to generate a second three-dimensional model of the object based in part on the material potential function and the first model. The second model illustrates propagation of the material through an interior volume of the object at a unit level. A controller generates control signals based on the second model, and a fluid ejection engine performs an additive manufacturing process based on the control signals.
    Type: Application
    Filed: July 26, 2017
    Publication date: July 16, 2020
    Applicants: Instituto Atlântico, Hewlett-Packard Development Company, L.P.
    Inventors: Marcelo Riss, Jamie Machado Neto, Victor Praxedes, Ana Patricia Del Angel, Adriana Fontenele, Thiago Moura, Jun Zeng, Scott White, Sebastia Cortes I Herms