Abstract: A false fingernail kit in which false fingernail blanks are formed unitary with a surrounding frame having portions establishing an imaginary envelope within which the blanks are enveloped, the frame being placed in a receptacle having a configuration complementary to the imaginary envelope for establishing a package for the kit. The receptacle includes a window for viewing the packaged fingernail blanks and the frame includes portions defining a compartment in the receptacle for receiving a container of adhesive and a container of adhesive remover. The fingernail blanks are each interconnected with the frame at a limited portion of the blank to facilitate tearing the blank from the frame without mutilation of the blank, and the frame includes basal surfaces for resting the frame in alternate orientations upon a support surface during use of the kit.