Patents Assigned to Instrument Technology Research Center, National Applied Laboratories
  • Method for whole field thin film stress evaluation
    Patent number: 7403270
    Abstract: A novel method for whole field thin film stress evaluation is provided. Through the provided method, the whole filed thin film stress distribution for an optical thin film would be developed with a commercial interferometer, so that a whole field evaluation for the crack or peel-off of thin film is hence achievable.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: July 22, 2008
    Assignee: Instrument Technology Research Center, National Applied Laboratories
    Inventors: Chi Hung Huang, Hsien-I You, Mao-Yuan Shih, Chien-Jen Chen