Abstract: A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi(bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
Type:
Application
Filed:
February 2, 2009
Publication date:
September 17, 2009
Applicants:
THE FURUKAWA ELECTRIC CO., LTD., Int. Superconductivity Tech Ctr the Juridical Fdn.