Abstract: The invention relates to a method for producing a transponder, especially a contactless chip card (1) comprising at least one electronic component (chip module 2) and at least one antenna (3); the at least one electronic chip component (2) being disposed on a non-conducting substrate that serves as a support for the component. The at least one antenna is also disposed on a non-conducting substrate, the at least one electronic component (2) being applied to a first substrate and the antenna (3) on a second substrate. The entire circuit (1) is then produced by joining the individual substrates so that they are correctly positioned relative to each other. The components (2, 3) are contacted once the different substrates have been joint by means of auxiliary materials such as solder or glue, or without auxiliary materials by microwelding. The non-conducting substrates form a base card body.

Abstract: A transponder inlay for a document for personal identification is provided which has at least one ID page with a layered construction. The layered construction has a transponder substrate for positioning a transponder unit, and includes a chip unit and an antenna, and two inlay cover layers, which receives the transponder substrate between them. The transponder substrate is formed from a thermoplastic, and the inlay cover layers are made of a foamed plastic.