Patents Assigned to Integral Technology, Inc.
  • Structures for z-axis interconnection of multilayer electronic substrates
    Patent number: 9545017
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: January 10, 2017
    Assignees: Ormet Circuits, Inc., Integral Technology, Inc.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES
    Publication number: 20140231126
    Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.
    Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
  • FLEXIBLE BENZOXAZINE RESIN
    Publication number: 20130317155
    Abstract: One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 28, 2013
    Applicant: Integral Technology, Inc.
    Inventors: Christopher A. Hunrath, Khang Tran
  • INSULATING LAYER FOR RIGID PRINTED CIRCUIT BOARDS
    Publication number: 20120227258
    Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
    Type: Application
    Filed: May 22, 2012
    Publication date: September 13, 2012
    Applicant: INTEGRAL TECHNOLOGY, INC.
    Inventor: Christopher A. Hunrath
  • Insulating layer for rigid printed circuit boards
    Patent number: 8188373
    Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: May 29, 2012
    Assignee: Integral Technology, Inc.
    Inventor: Christopher A. Hunrath