Abstract: The preparation of a semiconductor substrate for epitaxial deposition and the deposition of a solution from which the epitaxial film is formed is carried out at room temperature. The solution is deposited on the condensing surface in two discrete layering operations, the first of which ensures complete wetting of the condensing surface, the second of which ensures junction formation at a prescribed depth. The procedure is particularly useful in forming P Type epitaxial films on N-Type gallium phosphide substrates.