Abstract: A magnetically tunable ferrimagnetic filter, including a top casing, a top magnetic conductor, a bottom magnetic conductor, coils, a balance coil, ferrimagnetic-based filters, and a bottom casing. The ferrimagnetic-based filters utilize ferrimagnetic resonator elements, such as yttrium-iron-garnet (YIG), configured to reduce a magnetic gap of the YIG filter and thereby to improve performance.

Abstract: A magnetically-tunable ferrimagnetic radio frequency (RF) circuit sub-assembly can include a resonant cavity comprising a first magnetically conductive member spaced apart from a second magnetically conductive member, and a side wall. The sub-assembly can include first and second ferrimagnetic elements arranged in spaced apart relation within the resonant cavity. The sub-assembly can include a transmission line comprising a first portion located for RF coupling to the first ferrimagnetic element and a second portion located for RF coupling to the second ferrimagnetic element.

Abstract: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.

Abstract: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard high current, low voltage power supply, and may also have ground connections for selective connection to a ground layer. The heater layer may be embedded in a carrier board of a surface mount module close to the lower solder interface layer, or may be embedded in a host board of an electronics assembly close to the mounting surface.