Abstract: A high thermal conductivity substrate includes multiple substrate material layers each having a first plane and a second plane opposite to the first plane, thermal conducting columns arranged in the substrate material layers and respectively extending through the first planes and second planes of each substrate material layer along its thickness direction, and multiple thermal conducting layers arranged on the first plane of each substrate material layer and the second plane of one substrate material layer that is to be disposed at the bottom side of the substrate and connected to the thermal conducting columns in the respective substrate material layers to form a horizontally and vertically distributed thermal conducting network.