Abstract: A punch guide/receptacle for a dambar-removal tool set has a mounting fixture and an insert adapted to mount to an adaptive region of the mounting fixture. Apertures for punch teeth in the guide/receptacle are a part of the insert. In practicing the invention inserts may be removed and repaired. In one embodiment the insert has an upper and a lower row of apertures, and repair may be accomplished in some instances simply by reversing the insert in the mounting block.

Abstract: A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

Abstract: A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: A punch for removing material from lead frames has a substantially rectangular body with an array of grooves along one side and a step removed on one end from the side opposite the grooves to provide an array of punch teeth extending from the body of the punch. The grooves provide a means of reworking the punch to provide a new array of teeth, by machining away all or part of the teeth and then extending the step in the direction of the groove to provide substantially the original length for the individual teeth. By providing a punch with groove length several times the tooth length, the punch can be reworked several times before being discarded. Methods for forming the punch and for reworking the punch after breakage or wear are disclosed.

Abstract: A punch for removing material from lead flames has a substantially rectangular body with an array of grooves along one side and a step removed on one end from the side opposite the grooves to provide an array of punch teeth extending from the body of the punch. The grooves provide a means of reworking the punch to provide a new array of teeth, by machining away all or part of the teeth and then extending the step in the direction of the groove to provide substantially the original length for the individual teeth. By providing a punch with groove length several times the tooth length, the punch can be reworked several times before being discarded. Methods for forming the punch and for reworking the punch after breakage or wear are disclosed.

Abstract: An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.

Abstract: A punch for removing material from lead frames has a substantially rectangular body with an array of grooves along one side and a step removed on one end from the side opposite the grooves to provide an array of punch teeth extending from the body of the punch. The grooves provide a means of reworking the punch to provide a new array of teeth, by machining away all or part of the teeth and then extending the step in the direction of the groove to provide substantially the original length for the individual teeth. By providing a punch with groove length several times the tooth length, the punch can be reworked several times before being discarded.

Abstract: An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.