Abstract: Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.

Abstract: Planarization of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly scanned and a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.

Abstract: Recycled slurry is continuously blended with the slurry in use to provide a consistent polishing rate while consuming or discarding a small fraction of the slurry flowing continuously across the polishing pad. The slurry is recovered in a catch ring and fed to a recycle loop to blend the recovered slurry with fresh slurry, rejuvenating chemicals, or water; test the blend; filter the blend; and return the blend to the polishing pad. The volume returned to the pad slightly exceeds the volume recovered, causing the catch ring to overflow. Rinse water is recycled in the same fashion to keep the polishing pad wet between polishing cycles.

Abstract: A polishing head for chemical-mechanical polishing apparatus includes a carrier plate having concentric, integral, cylindrical walls, an annular piston fitting within the outer of the cylindrical walls and a second piston fitting within the inner cylindrical wall and engaging the annular piston. Each piston defines a chamber with the carrier plate and the chambers are isolated from each other by a seal. Pneumatic fittings supply air or vacuum to each chamber. The second piston includes a cylindrical side wall and an integral bottom plate. The bottom plate is thicker in the center than at the side wall and the underside of the plate is covered with a wafer adhering layer. A retaining ring is attached to the lower edge of the annular piston. The retaining ring includes a peripheral groove for separating an outwardly extending flange from the main body of the ring. The underside of the ring includes one or more spiral grooves for circulating slurry about a wafer during polishing.

Abstract: A system and process for removing a layer of a defined composition from a semiconductor wafer by performing at least one dry layer removal operation and at least one wet removal operation. A dry removal unit and a wet removal unit are disposed adjacent one another and robot mechanisms are provided to automatically transfer one wafer at a time through each unit in turn. The robot mechanisms are constructed to contact each wafer substantially at its edge in order to assure uniform treatment of both major surfaces of the wafer.For stripping a resist layer from a wafer, the dry stripping operation can be performed first to remove a portion of the layer, after which the remainder of the layer is removed by the wet stripping operation.