Abstract: A sensing device that comprises a micromachined tube on a substrate for resonant sensing of mass flow and density of a fluid flowing through the tube. The sensing device further incorporates on the same substrate at least a second micromachined tube configured for sensing another property of the fluid, such as pressure, viscosity and/or temperature.

Abstract: A method and device for performing fluid analysis by separating cells and/or particles from a fluid, such as a biological, vehicular or industrial fluid. The device is a micromachined filtering device comprising a substrate with through-thickness vias having approximately equal diameters that prevent passage through the substrate of a first material while permitting passage through the substrate of other materials having diametrical dimensions less than the diameter of the vias. Electrodes are located on a surface of the substrate between vias so that as the first material collects at the surface of the substrate, the electrodes become electrically connected to produce an output signal in some proportion to the amount of the first material collected. The device can incorporate multiple micromachined substrates, yielding an analysis system that produces an electrical output for each of a number of properties or parameters.

Abstract: Unwanted gasses created during bonding within micromachined vacuum cavities are reduced in a manner conducive to mass manufacturing. Two broad approaches may be applied separately or in combination according to the invention. One method is to deposit a barrier layer within the cavity (for example, on an exposed surface of the substrate). Such a layer not only provides a barrier against gases diffusing out of the substrate, but is also chosen so as to not outgas by itself. Another approach is to use a material which, instead of, or in addition to, acting as a barrier layer, acts as a getterer, such that it reacts with and traps unwanted gases. Incorporation of a getterer according to the invention can be as straightforward as depositing a thin metal layer on the substrate, which reacts to remove the impurities, or can be more elaborate through the use of a non-evaporable getter in a separate cavity in gaseous communication with the cavity.

Abstract: A sensing device that comprises a micromachined tube on a substrate for resonant sensing of mass flow and density of a fluid flowing through the tube. The sensing device further incorporates on the same substrate at least a second micromachined tube configured for sensing another property of the fluid, such as pressure, viscosity and/or temperature.

Abstract: A microneedle and a process of forming the microneedle of single-crystal silicon-based material without the need for deposited films. The microneedle comprises a piercing end, an oppositely-disposed second end, and an internal passage having an opening adjacent the piercing end. The cross-section of the microneedle, and therefore the passage within the microneedle, is defined by first and second walls formed of doped single-crystal silicon-based material and separated by the passage, and first and second sidewalls separated by the passage, sandwiched between the first and second walls, and formed of single-crystal silicon-based material that is more lightly doped than the first and second walls.

Abstract: A method and device for performing lysing on a cell-containing fluid, in which the fluid flows through a vibrating micromachined tube to physically rupture the cell walls (mechanical lysis), and/or to mix, agitate or homogenize the fluid during chemical lysis, and/or to mix, agitate or homogenize the lysate for analysis or other processing after lysing. The tube includes a freestanding portion spaced apart from a surface of a substrate on which the tube is formed. The device further includes means for vibrating the freestanding portion of the tube at a level sufficient to rupture the walls of cells in a fluid flowing through the freestanding portion (for mechanical lysing) or to mix the fluid and a chemical lysing additive within the freestanding portion (for chemical lysing).

Abstract: Micromachine fluidic apparatus incorporates a free-standing tube section and electrodes to actuate or control the movement of the tube section, or to sense the movement of the tube section, or both. Electronic circuitry, which may be disposed on the same substrate as the fluidic portion of the apparatus, is used in conjunction with the tube and electrodes in conjunction with a variety of different applications, including fluid flow measurement, fluid density measurement, fluid viscosity measurement, fluid transport, separation and/or mixing. According to a particular embodiment, the free-standing section of the tube is resonated for fluid flow and density measurements according to the Coriolis effect. Capacitive/electrostatic actuation techniques are used to control or resonate the free-standing section of the tube, and to detect variations in tube movement.

Abstract: Structures and methods are disclosed in conjunction with the fabrication of electrical lead transfer feedthroughs with respect to a sealed cavity. In some applications such as capacitive pressure sensing, the cavity may include an outer wall, in which case the electrically insulating barrier is preferably U-shaped, with the ends of the U terminating at the outer wall. The feedthrough section may alternatively take the form of an island of conductive material surrounded by the electrically insulating barrier, thus assuming an O-shape. The cavity may be evacuated or filled with specific gases at specific pressures. As such, the invention finds application in the packaging (vacuum or controlled environment) and production of a variety of transducers including but not limited to pressure sensors, flow sensors, optical devices (e.g., infrared detectors, ccd camera, and flat-panel displays) and resonating devices, such as gyroscopes, accelerometers, yaw sensors, telecommunication devices, etc.

Abstract: A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment.