Abstract: A mobile antenna array system has a first baseplate with a first groundplane. An elevated second baseplate defines an elevated second groundplane. A plurality of support antennas are positioned between the first baseplate and the elevated second baseplate. The plurality of support antennas comprise multiple antennas configured to work at different frequencies. The plurality of support antennas are coupled to the first and second baseplates in mechanical connections that provide enhanced stability, tight tolerances, repeatability and low cost through the use of printed circuit boards as substrates for one or more of the antennas and baseplates. An elevated GPS antenna is positioned above the elevated second baseplate in use. The elevated GPS antenna is configured to work within a GPS range of frequencies different from the support antenna ranges of frequencies. The elevated GPS antenna has improved GPS transmissions and the support antennas also have improved positioning and functionality.
Type:
Grant
Filed:
February 1, 2022
Date of Patent:
October 3, 2023
Assignee:
Integrity Microwave, LLC
Inventors:
Richard Loy Smith, Jr., Wesley Dale Sarratt
Abstract: A mobile antenna array system has a first baseplate with a first groundplane. An elevated second baseplate defines an elevated second groundplane. A plurality of support antennas are positioned between the first baseplate and the elevated second baseplate. The plurality of support antennas comprise multiple antennas configured to work at different frequencies. The plurality of support antennas are coupled to the first and second baseplates in mechanical connections that provide enhanced stability, tight tolerances, repeatability and low cost through the use of printed circuit boards as substrates for one or more of the antennas and baseplates. An elevated GPS antenna is positioned above the elevated second baseplate in use. The elevated GPS antenna is configured to work within a GPS range of frequencies different from the support antenna ranges of frequencies.
Type:
Grant
Filed:
September 10, 2020
Date of Patent:
February 8, 2022
Assignee:
Integrity Microwave, LLC
Inventors:
Richard Loy Smith, Jr., Wesley Dale Sarratt