Abstract: Metal insulator metal capacitors are described. In an example, a metal-insulator-metal (MIM) capacitor includes a first electrode that includes a bottom region and a pair of vertical regions. First metal layers are outside the vertical regions and in contact with the vertical regions. An insulator is over the first electrode. A second electrode is over the insulator. A second metal layer is on a top surface of the second electrode.

Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

Abstract: Embodiments are generally directed to area-efficient implementations of graphics instructions. An embodiment of an apparatus includes a graphics subsystem including one or more of a first logic for processing of memory read-return data for single-instruction-multiple-data instructions; a second logic for assembly of memory read-return data for media block instructions into shader register format; or a third logic to remap scatter or gather instructions to untyped surface instruction types. An embodiment of an apparatus includes a graphics subsystem including a translation lookaside buffer (TLB) and a data port controller to control the TLB, the data port controller including an incoming request pipeline to receive an incoming request with virtual address and generate a response, an incoming response pipeline to receive the response and generate a cache request, and an invalidation flow pipeline.