Abstract: A multi-package integrated circuit assembly can include a first electronic package having a first package substrate including a first die side and a first interface side. A first die can be electrically coupled to the first die side. A second electronic package can include a second package substrate having a second die side and a second interface side. A second die can be electrically coupled to the second die side. A metallic plated hole can be electrically coupled from the interface side of the first package substrate to the interface side of the second package substrate. A collective substrate can be attached to the first electronic package. For instance, the collective substrate can be located on a face of the first electronic package opposing the first package substrate. The collective substrate is electrically coupled to the first die and the second die through the first package substrate.

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.