Abstract: Conductive structure technology is disclosed. In one example, a conductive structure can include an interconnect and a plurality of conductive layers overlying the interconnect. Each conductive layer can be separated from an adjacent conductive layer by an insulative layer. In addition, the conductive structure can include a contact extending through the plurality of conductive layers to the interconnect. The contact can be electrically coupled to the interconnect and insulated from the plurality of conductive layers. Associated systems and methods are also disclosed.

Abstract: An improved instruction decoder is described which uses parallel stages which operate in a pipeline fashion. The decoder is particularly useful in a microprocessor which has variable length instructions. The first stage decodes the OP code and register and address mode specifier fields while the second stage directs the sequencing of address calculations. The first two lines of microcode are provided by the first stage as well as a look up to microcode in the microcode memory.