Abstract: A student model may be trained in two stages by using two teacher models, respectively. The first teacher model has been trained with a pretraining dataset. The second teacher model has been trained with a training dataset that is specific to a task to be performed by the student model. In the first stage, the student model may be generated based on a structure of the first teacher model. Internal parameters of the student model are adjusted through a pretraining process based on the first teacher model and the pretraining dataset. Weights of the student model may be pruned during the pretraining process. In the second stage, a sparsity mask is generated for the student model to lock the sparsity pattern generated from the first stage. Further, some of the internal parameters of the student model are modified based on the second teacher model and the training dataset.

Abstract: Live objects in heap memory exceeding a threshold size and that have not been recently accessed are compressed or offloaded to secondary memory or storage. Compressing or offloading an object can further be based on how old the object is, which can be determined based on how many garbage collections the object has survived. Objects comprising references to other objects can be split into two sub-objects, one containing value fields that is compressed or offloaded and one containing reference fields that remains uncompressed in heap memory. Heap memory can undergo compaction after objects are compressed or offloaded. Compression accelerators can be used for compression and the decision of whether to compress or offload an object can be based on accelerator throughput, latency, availability, as well as other computing system metrics or characteristics. The compressing and offloading of objects and subsequent compaction can make more heap memory available for object allocation.

Abstract: A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase.

Abstract: An apparatus may be configured to perform a time-sensitive communication via a Multi User (MU) Multiple-Input-Multiple-Output (MIMO) (MU-MIMO) transmission. For example, an Access Point (AP) may be configured to transmit MU-MIMO schedule information to schedule an MU-MIMO transmission including a plurality of spatial streams, the plurality of spatial streams including a first spatial stream allocated to a scheduled data transmission of a scheduled wireless communication station (STA), and a second spatial stream allocated as a reserved spatial stream, which is reserved for an unscheduled time-sensitive communication with a time-sensitive STA; and to communicate the scheduled data transmission with the scheduled STA over the first spatial stream.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate, and a first pad over the package substrate. In an embodiment, a layer is over the package substrate, where the layer is an insulating material. In an embodiment, the electronic package further comprises a via through the layer and in contact with the first pad. In an embodiment a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width. In an embodiment, the electronic package further comprises a second pad over the via.

Abstract: An apparatus is described. The apparatus includes I/O structures having pads and solder balls to couple with a semiconductor chip, wherein, a first subset of pads and/or solder balls of the pads and solder balls that approach the semiconductor chip during coupling of the semiconductor chip to the I/O structures are thinner than a second subset of pads and/or solder balls of the pads and solder balls that move away from the semiconductor chip during the coupling of the semiconductor chip to the I/O structures.

Abstract: The present disclosure describes a telemetry redundant measurement avoidance protocol (TRMAP) that solves redundant data collection problems in telemetry systems. The TRMAP can operate in a non-supervised environment and/or in a distributed manner, and does not require a central controller to manage multiple collection agents in one or multiple telemetry systems. The TRMAP can also be an opt-in-based protocol that favors altruistic data sharing and reuse between collection agents. In these ways, the TRMAP provides freedom and collaboration among developers or other entities that desired telemetry data, while allowing non-compliant collection agents to coexist, if possible.

Abstract: The apparatus for the autonomously acting machine comprises an interface for communicating with a computer system, wherein the computer system is separate from the autonomously acting machine. The apparatus includes a processor for executing machine-readable instructions for providing information about an internal state of the autonomously acting machine to the computer system, obtaining a feedback signal from the computer system, the feedback signal indicating whether sensor data for observing the autonomously acting machine is consistent with the internal state of the autonomously acting machine, and wherein the feedback signal is based on a comparison between a digital twin of the autonomously acting machine and the sensor data, wherein an internal state of the digital twin is based on the internal state of the autonomously acting machine, and operating the autonomously acting machine based on the feedback signal.

Abstract: Gate-all-around integrated circuit structures having depopulated channel structures, and methods of fabricating gate-all-around integrated circuit structures having depopulated channel structures using a directed bottom-up approach, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires above a substrate. A gate stack is over and around the vertical arrangement of nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of nanowires, the second end opposite the first end, wherein at least one of the first or second epitaxial source or drain structures is coupled to fewer than all nanowires of the vertical arrangement of nanowires.

Abstract: In a multitenant environment, confidential containers for the tenant having a trusted execution environment (TEE) which have security attested, can share data within the pod or between pods. The ability to share data for confidential containers of the same tenant eliminates the need to have multiple copies for different confidential containers. Thus, a storage device can store shared data specific to a tenant of the multitenant environment, and a caching service backed by protected hardware can manage access to the shared data. Management of the shared data can include attesting a key for a confidential container to verify that the confidential container is part of the TEE for a pod for the tenant, and access the shared data from the storage device for the confidential container based on the attested key.

Abstract: Systems, apparatuses, and methods include technology that determines, with a neural network, that a first eviction node stored in a cache will be evicted from the cache based on a cache policy. The first eviction node is part of a plurality of nodes associated with a graph. Further, a subset of nodes of the plurality of nodes remains in the cache after the eviction of the first eviction node from the cache. The technology further tracks a number of cache hits on the cache during an aggregation operation associated with a hardware accelerator, where the aggregation operation is executed on the subset of nodes that remain in the cache after the eviction of the eviction node from the cache. The technology executes a training process on the neural network to adjust the cache policy based on the number of the cache hits.

Abstract: Disclosed herein are embodiments of a broadband wavemeter system comprising: a laser source to generate an optical signal having one or more wavelengths; a tap to separate a portion of the optical signal from the laser source; a splitter to split an incoming optical signal from the tap into a plurality of outgoing optical signals; a plurality of wavemeters, each one in the plurality to receive one of the outgoing optical signals from the splitter, in which each wavemeter in the plurality of wavemeters comprises a Mach-Zehnder Interferometer (MZI), and each wavemeter has at least one of free spectral range (FSR) detuning and center wavelength detuning, and a control circuit to collate outputs from individual ones of the plurality of wavemeters to monitor, detect and control the laser source.

Abstract: Various systems and methods for implementing protocol state aware power management are described herein. A network interface device for implementing protocol state aware power management includes circuitry to provide a direct memory access interface; medium access control (MAC) circuitry to interface with a network; and control circuitry to: classify packets received at the MAC circuitry as packets used to open network connections or packets used to close network connections; maintain statistics of packets used to open network connections and packets used to close network connections; calculate a power hint based on the statistics of packets used to open connections and packets used to close network connections; and write a receive descriptor to a host memory using the direct memory access interface, the receive descriptor including a power hint field with the power hint, the power hint used by a host processor to scale processor power based on the power hint.

Abstract: Various embodiments herein provide techniques for determination of hybrid automatic repeat request (HARQ) process identifier (ID). The techniques may be used, for example, for multi-transmission scheduling by a single downlink control information (DCI) and/or in higher carrier frequencies. Other embodiments may be described and claimed.

Abstract: An integrated circuit includes a first device having a first source or drain region, and a second device having a second source or drain region that is laterally adjacent to the first source or drain region. A conductive source or drain contact includes (i) a lower portion in contact with the first source or drain region, and extending above the first source or drain region, and (ii) an upper portion extending laterally from above the lower portion to above the second source or drain region. A dielectric material is between at least a section of the upper portion of the conductive source or drain contact and the second source or drain region. In an example, each of the first and second devices is a gate-all-around (GAA) device having one or more nanoribbons, nanowires, or nanosheets as channel regions, or is a finFet structure having a fin-based channel region.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to using full stack overlay cell (FSOL) targets within lithography masks and on fabricated layers of a substrate in order to align or to assess the alignment of fabricated layers of the substrate during the substrate manufacturing process. Other embodiments may be described and/or claimed.

Abstract: Systems, apparatuses, methods, and computer-readable media are provided for channel state information (CSI)-reference signal (RS) triggering for multiple user equipments (UEs) using a single downlink control information (DCI). In some embodiments, a new radio network temporary identifier (RNTI) may be used to indicate triggering of CSI-RS transmission for multiple UEs. Additionally, or alternatively, a new DCI format may be used that supports CSI-RS triggering for multiple UEs. The techniques described herein may provide reduced DCI overhead compared with prior techniques. Other embodiments may be described and claimed.

Abstract: Multi-tile Memory Management for Detecting Cross Tile Access, Providing Multi-Tile Inference Scaling with multicasting of data via copy operation, and Providing Page Migration are disclosed herein. In one embodiment, a graphics processor for a multi-tile architecture includes a first graphics processing unit (GPU) having a memory and a memory controller, a second graphics processing unit (GPU) having a memory and a cross-GPU fabric to communicatively couple the first and second GPUs. The memory controller is configured to determine whether frequent cross tile memory accesses occur from the first GPU to the memory of the second GPU in the multi-GPU configuration and to send a message to initiate a data transfer mechanism when frequent cross tile memory accesses occur from the first GPU to the memory of the second GPU.

Abstract: Methods, apparatus, systems, and articles of manufacture to identify regions of interest of an image based on a variable rate shading (VRS) mask created from a video image. A method to detect the regions can include detecting, with one or more processors, regions of interest of the video image based on the VRS mask, the VRS mask generated by a renderer. The method can also include encoding, with one or more processors, the regions of interest of the video image, the encoding to include adjusting a quantization parameter suitable to encoding the regions of interest.

Abstract: IC structures including BPRs used for ESD ballasting are disclosed. An IC structure includes semiconductor structures of one or more transistors. A semiconductor structure may be a fin, nanowire, or nanoribbon of a semiconductor material. The IC structure also includes an electrically conductive layer coupled to the semiconductor structures, a power rail, and a support structure. The power rail is coupled to the electrically conductive layer by a via. The power rail is buried in a support structure. The combination of the power rail and the via constitutes a ESD ballasting resistor for the semiconductor structures. A resistance of the ESD ballasting resistor can be in a range from 5 to 20 ohms. The IC structure may include two or more power rails. A power rail may be arranged between two of the semiconductor structures. The power rails may form a meander structure with other components of the IC structure.