Abstract: System and method for prefetching pointer-referenced data. A method embodiment includes: tracking a plurality of load instructions which includes a first load instruction to access a first data that identifies a first memory location; detecting a second load instruction which accesses a second memory location for a second data, the second memory location matching the first memory location identified by the first data; responsive to the detecting, updating a list of pointer load instructions to include information identifying the first load instruction as a pointer load instruction; prefetching a third data for a third load instruction prior to executing the third load instruction; identifying the third load instruction as a pointer load instruction based on information from the list of pointer load instructions and responsively prefetching a fourth data from a fourth memory location, wherein the fourth memory location is identified by the third data.

Abstract: An apparatus and method for complex matrix conjugation and multiplication.

Abstract: A processor includes a memory subunit that includes a status register and an execution engine unit to: randomly select a load operation to monitor; determine a re-order buffer identifier of the load operation; and transmit the re-order buffer identifier to the memory subsystem. Responsive to receipt of the re-order buffer identifier, the first memory subunit is to store a piece of information, related to a status of the load operation, in the status register. The processor also includes logic to, responsive to detection of retirement of the load operation, store memory information in memory-related fields of a record of a memory buffer. The memory information includes auxiliary information (AUX) and access latency information, wherein one of the auxiliary information or the access latency information includes the piece of information, from the status register, stored in a particular field of the memory-related fields.

Abstract: A foundation layer and methods of forming a conductive via are described. A die pad is formed over a die. A seed layer is deposited over the die pad and the foundation layer. A first photoresist layer is deposited over the seed layer, and the first layer is patterned to form a conductive line opening over the die pad. A conductive material is deposited into the conductive line opening to form a conductive line. A second photoresist layer is deposited over the first layer, and the second layer is patterned to form a via opening over the conductive line. The conductive material is deposited into the via opening to form the conductive via, where the conductive material only deposits on portions of exposed conductive line. The second and first layers are removed. Portions of exposed seed layer are recessed, and then a top surface of the conductive via is exposed.

Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

Abstract: Various embodiments herein provide techniques for minimum mean-square error interference rejection combining (MMSE-IRC) processing of a received signal, distributed between a baseband unit (BBU) and a remote radio unit (RRU). The RRU may perform uplink receive beamforming (e.g., using maximum ratio combining (MRC)) based on multiple channel measurements (e.g., a set of multiple sounding reference signal (SRS) channel measurements) obtained on respective measurement signals transmitted by a user equipment (UE). The RRU may send the processed signal to the BBU for further processing. The BBU may perform MMSE-IRC based on the processed signal received from the RRU, e.g., using demodulation reference signals (DM-RSs). Other embodiments may be described and claimed.

Abstract: Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to configure heterogenous components in an accelerator. An example apparatus includes a graph compiler to identify a workload node in a workload and generate a selector for the workload node, and the selector to identify an input condition and an output condition of a compute building block, wherein the graph compiler is to, in response to obtaining the identified input condition and output condition from the selector, map the workload node to the compute building block.

Abstract: The present disclosure is directed to a position-controlled lamination tool or press that includes an array or plurality of pressure sensors and an array or plurality of heating/cooling elements or components, which may be coupled together, for preventing or reducing laminating film or material bleed out and improving thickness variation performance. The pressure sensors may provide a controller, which is coupled to the lamination tool, with real-time feedback on any thickness variations across a substrate panel and the controller may adjust the temperature output of the heating and cooling elements to locally modify the viscosity of the laminating material in one or more regions of the substrate panel to either decrease or increase the flowability of the laminating material.

Abstract: Methods, apparatus, and articles of manufacture to conditionally activate a big core in a computing system are disclosed. An example apparatus including instructions stored in the apparatus; and processor circuitry to execute the instructions to: in response to a request to operate two or more processing devices as a single processing device, determine whether the two or more processing devices are available and capable of executing instructions according to the request; when the two or more processing devices are available and capable: split the instructions into first sub-instructions and second sub-instructions; provide (a) the first sub-instructions to a first processing device of the two or more processing devices and (b) the second sub-instructions to a second processing device of the two or more processing devices; and generate an output by combining a first output of the first processing device and a second output of the second processing device.

Abstract: Various systems and methods of initiating and performing contextualized AI inferencing, are described herein. In an example, operations performed with a gateway computing device to invoke an inferencing model include receiving and processing a request for an inferencing operation, selecting an implementation of the inferencing model on a remote service based on a model specification and contextual data from the edge device, and executing the selected implementation of the inferencing model, such that results from the inferencing model are provided back to the edge device. Also in an example, operations performed with an edge computing device to request an inferencing model include collecting contextual data, generating an inferencing request, transmitting the inference request to a gateway device, and receiving and processing the results of execution. Further techniques for implementing a registration of the inference model, and invoking particular variants of an inference model, are also described.

Abstract: This disclosure describes systems, methods, and devices related to multi-link power save indication. A device may establish two or more links with a non-access point (AP) multi-link device (MLD). The device may connect a first AP of the AP MLD to a first station device (STA) of the non-AP MLD using a first link. The device may connect a second AP of the AP MLD to a second STA of the non-AP MLD using a second link. The device may use a link bitmap field included in a frame, wherein the link bitmap field comprises a first bit associated with the first STA and a second bit associated with the second STA. The device may communicate with the non-AP MLD based on the link bitmap.

Abstract: Methods and systems for budgeted and simplified training of deep neural networks (DNNs) are disclosed. In one example, a trainer is to train a DNN using a plurality of training sub-images derived from a down-sampled training image. A tester is to test the trained DNN using a plurality of testing sub-images derived from a down-sampled testing image. In another example, in a recurrent deep Q-network (RDQN) having a local attention mechanism located between a convolutional neural network (CNN) and a long-short time memory (LSTM), a plurality of feature maps are generated by the CNN from an input image. Hard-attention is applied by the local attention mechanism to the generated plurality of feature maps by selecting a subset of the generated feature maps. Soft attention is applied by the local attention mechanism to the selected subset of generated feature maps by providing weights to the selected subset of generated feature maps in obtaining weighted feature maps.

Abstract: In one embodiment, an apparatus includes a port to transmit and receive data over a link; and protocol stack circuitry to implement one or more layers of a load-store input/output (I/O)-based protocol (e.g., PCIe or CXL) across the link. The protocol stack circuitry constructs memory write request transaction layer packets (TLPs) for memory write transactions, wherein fields of the memory write request TLPs indicate a virtual channel (VC) other than VC0, that a completion is required in response to the memory write transaction, and a stream identifier associated with the memory write transaction. The memory write request TLP is transmitted over the link and a completion TLP is received over the link in response, indicating a completion for the memory write request TLP.

Abstract: An antenna module and communication device containing the antenna module are disclosed. The antenna module is disposed in a metal cavity. The antenna module includes a switched beam mm-wave antenna array having radiating elements separated by less than a wavelength of the radiating elements. The array is fed by a single transceiver chain. The array is disposed at the focal length of a low-profile mm-wave lens configured to steer the beam. A sub-10 GHz antenna is disposed closer to the opening of the cavity than the lens. The lens is a Fresnel Zone Plate lens having a focal length of less than about the wavelength of the beam, or a Saucer lens having shells of different refractive indexes and having a profile that is more than 6 times smaller than a Luneburg lens with a same focal length.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: A port of a computing device is to communicate with another device over a link, the port including physical layer logic of a first protocol, link layer logic of each of a plurality of different protocols, and protocol negotiation logic to determine which of the plurality of different protocols to apply on the link. The protocol negotiation logic is to send and receive ordered sets in a configuration state of a link training state machine of the first protocol, where the ordered sets include an identifier of a particular one of the plurality of different protocols. The protocol negotiation logic is to determine from the ordered sets that a link layer of the particular protocol is to be applied on the link.

Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.

Abstract: A method, apparatus and system. The method includes: performing one or more training iterations to tune a target clock signal frequency to be applied at a memory device, each of the one or more training iterations including: causing a modified clock signal frequency to be applied at the memory device; and decoding a quality feedback message from the memory device including an indication of a performance of the clock signal frequency at the memory device; and in response to a determination that the performance of the clock signal frequency falls within a target performance range of the memory device and that the clock signal frequency is below the target clock signal frequency, performing a subsequent training iteration of the one or more training iterations, and otherwise causing application at the memory device, during a memory operation, of a highest clock signal frequency corresponding to a training iteration for which performance of the clock signal was within the target performance range.