Abstract: A light-emitting apparatus including a light-emitting device, a light-guiding structure and a light output structure is provided. The light-emitting device includes a light-emitting layer. The light-guiding structure is configured to guide light emitted from the light-emitting layer. The light-guiding structure is disposed beside the light-emitting device and a refractive index of the light-guiding structure is greater than or equal to an average refractive index of the light-emitting device. The light output structure is configured to receive the light guided by the light-guiding structure to output the light out of the light-emitting apparatus.

Abstract: A transparent display device including a substrate having a light emitting region and a light transmitting region, a light emitting element located in the light emitting region, a first wall structure having an undercut sidewall, a first top conductive pattern and a barrier multi-layer structure is provided. The first wall structure forms the boundary between the light emitting region and the light transmitting region and the light emitting element is located in the light emitting region surrounded by the first wall structure. The first top conductive pattern is disposed on the top surface of the first wall structure. The barrier multi-layer structure is disposed on the light emitting element. The barrier multi-layer structure includes a first barrier layer and a second barrier layer. An overlapping portion of the first barrier layer and the second barrier is located in the light emitting region surrounded by the first wall structure.

Abstract: A semiconductor package structure includes a redistribution structure, a chip, an upper dielectric layer, a plurality of conductive members and an encapsulation layer. The redistribution structure includes a redistribution layer and a first dielectric layer disposed on the redistribution layer. The upper dielectric layer is disposed between the chip and the first dielectric layer of the redistribution structure, wherein the upper dielectric layer and the first dielectric layer are organic materials. A plurality of conductive members is disposed between the redistribution layer and the chip. Each conductive member has a first end adjacent to the chip and a second end adjacent to the redistribution structure, wherein the first end of said each conductive member contacts with the upper dielectric layer and the second end of said each conductive member contacts with the first dielectric layer.

Abstract: A pixel structure including a substrate, a power wire, a planarization layer, a drive circuit and a conductive structure is provided. The substrate has a layout area and a light-transmitting area located outside the layout area. The power wire is disposed on the layout area of the substrate. The power wire includes a shielding layer. The planarization layer is disposed on the substrate and covers the power wire. The drive circuit is disposed on the planarization layer and corresponds to the layout area. The drive circuit includes a first active device. The shielding layer overlaps with the first active device. The conductive structure is disposed in the planarization layer and distributed corresponding to the layout area. The power wire is electrically connected with the drive circuit through the conductive structure. A display panel is also provided.

Abstract: An augmented reality display system including an input unit, an operation processing unit and an output unit is provided. The input unit is configured to obtain an environment information. The operation processing unit is configured to operate and process the environment information provided by the input unit to generate an output information. The output unit is configured to transmit the output information provided by the operation processing unit to a user. The output unit includes at least one display module. The at least one display module includes a transparent display, a first lens having a negative refractive power, a second lens having a negative refractive power and a third lens having a positive refractive power arranged in sequence from a display side to an eye side. An augmented reality display method is also provided.

Abstract: An augmented reality (AR) device including at least one optical module is provided. Each of the at least one optical module sequentially includes a transparent display, a first lens, a second lens, and a third lens from a display side to an eye side. The first lens has a negative refractive power. The second lens has a negative refractive power. The third lens has a positive refractive power. The number of lenses of the optical module having refractive powers is three, wherein the transparent display of the optical module is configured to emit a light beam, and the light beam sequentially passes through the first lens, the second lens, and the third lens to be incident into a user's eyes at the eye side, so that an AR virtual image on the display side is seen by the eyes.

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.

Abstract: A separating device includes a separating unit and a crack front line adjusting unit. The separating unit is adapted to separate the flexible film and the substrate. During the process of separating the flexible film from the substrate, a crack front line is formed between a portion of the flexible film not separated from the substrate and a portion of the flexible film separated from the substrate. The crack front line adjusting unit is adapted to sense a relative displacement state of the flexible film and the substrate for determining a distribution of the crack front line, and is adapted to apply a down pressing force to the flexible film or the substrate and increase or decrease the down pressing force according to the relative displacement state, so as to adjust the distribution of the crack front line.

Abstract: A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.

Abstract: A method for driving a dual-media display panel includes the following. Display data is obtained. A first driving signal for driving a transparent display panel of the dual-media display panel is generated in response to the display data. A display-unit grayscale value for the display data is obtained. The display-unit grayscale value is determined whether it falls within a grayscale value interval. When the display-unit grayscale value is less than a lower limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a black color is used as the second driving signal. When the display-unit grayscale value is greater than an upper limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a white color is used as the second driving signal.

Abstract: A method for driving a dual-media display panel includes the following. Display data is obtained. A first driving signal for driving a transparent display panel of the dual-media display panel is generated in response to the display data. A display-unit grayscale value for the display data is obtained. The display-unit grayscale value is determined whether it falls within a grayscale value interval. When the display-unit grayscale value is less than a lower limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a black color is used as the second driving signal. When the display-unit grayscale value is greater than an upper limit of the grayscale value interval, a driving signal adapted to enabling the light-shielding display panel to display a white color is used as the second driving signal.

Abstract: An image information display method, an image information display system and a display. The method includes: capturing a background image of the display; obtaining an object according the background image; capturing a relative movement information between a first user and the object; capturing a visual information corresponding to the first user; determining whether a reading comfort degree corresponding to the object meets a predetermined condition according to the relative movement information and the visual information; displaying a dynamic information corresponding to the object by the display when the reading comfort degree meets the predetermined condition; and not displaying the dynamic information corresponding to the object by the display when the reading comfort degree does not meet the predetermined condition.

Abstract: A touch panel driving apparatus generates a differential signal corresponding to a detection result of a touch panel. The touch panel driving apparatus includes a driving circuit, a first integrating sampling circuit, and a second integrating sampling circuit. The first integrating sampling circuit generates a first end signal of the differential signal. The second integrating sampling circuit generates a second end signal of the differential signal. When a touch event does not occur, a level of the first end signal and a level of the second end signal are in a common mode signal range of the differential signal. When the touch event occurs, the first integrating sampling circuit pulls up the level of the first end signal out of the common mode signal range, and the second integrating sampling circuit pulls down the level of the second end signal out of the common mode signal range.

Abstract: A protective structure includes a substrate, a hard coating layer and an auxiliary layer. The auxiliary layer is disposed on the substrate. The hard coating layer is disposed on the auxiliary layer. The auxiliary layer is disposed between the substrate and the hard coating layer. The Young's modulus of the auxiliary layer is greater than the Young's modulus of the hard coating layer, and the Young's modulus of the hard coating layer is greater than the Young's modulus of the substrate.

Abstract: A thin film transistor including a flexible substrate, a semiconductor layer, a first gate, and a first gate dielectric layer is provided. The semiconductor layer is located on the flexible substrate. The first gate is located on the flexible substrate and corresponds to a portion of the semiconductor layer. The first gate dielectric layer is located between the first gate and the semiconductor layer. The first gate dielectric layer is in contact with the semiconductor layer, and the hydrogen atom concentration of the first gate dielectric layer is less than 6.5×1020 atoms/cm3. A method of manufacturing the thin film transistor is also provided.

Abstract: A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.

Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Abstract: An interactive display system and an interactive display controlling method are provided. The interactive display system includes an interactive controller and an interactive display module. The interactive controller includes multiple marking patterns presented on a surface of the interactive controller. The interactive display module includes a display, an image capturing device and a processor. The image capturing device captures a marking image of the marking patterns. The processor is coupled to the display and the image capturing device, the processor obtains location information of the interactive controller, calculates a directional angle of the interactive controller according to a relative position relationship of the marking patterns in the marking image, and calculates a directional coordinate of the interactive controller according to the directional angle and the location information. The display displays an indication object at a position associated with the directional coordinate.

Abstract: A flexible chip package is provided. The flexible chip package includes a first flexible substrate; a first redistribution layer disposed on the first flexible substrate; a second flexible substrate; a second redistribution layer disposed on the second flexible substrate; a semiconductor chip disposed between the first and second redistribution layers and electrically connected to at least one of the first and second redistribution layers; and a first bonding layer disposed between the first and second redistribution layers and encapsulating the semiconductor chip, wherein the first bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.

Abstract: A redistribution layer structure of the semiconductor package includes a dielectric layer having a thickness, at least one upper conductive wire disposed on a first surface of the dielectric layer, at least one lower conductive wire disposed on a second surface of the dielectric layer, and vias penetrating the dielectric layer and connecting the at least one upper conductive wire and the at least one lower conductive wire. Each via has a cross-section at one upper conductive wire. The cross-section has a third width. The ratio of the third width to the thickness of the dielectric layer is less than or equal to 1. The ratio of the pitch between every two adjacent vias to the third width is greater than or equal to 0.5.