Patents Assigned to Inteltech Corporation
  • Patent number: 8534873
    Abstract: A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by a conductor assembly and control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the mounting assembly, wherein both the mounting assembly and the cover structure are formed of heat conductive material, thereby effectively dissipating the heat generated by the LED illumination assembly. The conductor assembly, comprising at least one electrically conductive material connector, mechanically interconnects components, including the illumination source and the mounting assembly, into an assembled orientation. A non-conductive insulation assembly or a predetermined air space isolates the at least one conductive connector from the mounting assembly to avoid electrical contact there between.
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Inteltech Corporation
    Inventors: Daryl Soderman, Dale B. Stepps
  • Patent number: 8360614
    Abstract: A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the illumination assembly, wherein the cover structure, which has an enlarged surface area formed of a heat conductive material, defines a decorative exterior of the light fixture and is disposed exterior of a mounting surface, thereby effectively dissipating the heat generated by the LED illumination assembly towards the environment being illuminated by the light fixture.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: January 29, 2013
    Assignee: Inteltech Corporation
    Inventors: Daryl Soderman, Dale B. Stepps
  • Patent number: 7980736
    Abstract: A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the mounting assembly, wherein both the mounting assembly and the cover structure are formed of conductive material, thereby effectively dissipating the heat generated by the LED illumination assembly. The illumination assembly is connected to a source and electric energy by a conductor assembly comprising one or more conductive material connectors mechanically interconnecting components of the light fixture into an assembled orientation. A non-conductive insulation assembly isolates each of the one or more conductive connectors from the mounting assembly to avoid electrical contact there between.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: July 19, 2011
    Assignee: Inteltech Corporation
    Inventors: Daryl Soderman, Dale B. Stepps
  • Patent number: 7878692
    Abstract: A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the mounting assembly, wherein both the mounting assembly and the cover structure are formed of conductive material, thereby effectively dissipating the heat generated by the LED illumination assembly. The illumination assembly is connected to a source and electric energy by a conductor assembly comprising one or more conductive material connectors mechanically interconnecting components of the light fixture into an assembled orientation. A non-conductive insulation assembly isolates each of the one or more conductive connectors from the mounting assembly to avoid electrical contact there between.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: February 1, 2011
    Assignee: Inteltech Corporation
    Inventors: Daryl Soderman, Dale B. Stepps
  • Patent number: 7810960
    Abstract: A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the illumination assembly, wherein the cover structure, which has an enlarged surface area formed of a heat conductive material, defines a decorative exterior of the light fixture and is disposed exterior of a mounting surface, thereby effectively dissipating the heat generated by the LED illumination assembly towards the environment being illuminated by the light fixture.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: October 12, 2010
    Assignee: Inteltech Corporation
    Inventors: Daryl Soderman, Dale B. Stepps
  • Patent number: 7760107
    Abstract: A system and method for variably programming a plurality of utilitarian devices such as, but not limited to, LED light assemblies, motions detectors, etc. which may be associated with each of a plurality of control points. The control points are electrically interconnected to one another and to a power source to define a network, wherein an identifying code is assigned to each of the control points. One or more control facilities in the form of touch pads are cooperatively structured with a master control for programmed operations of separate predetermined numbers or arrays of said plurality of control points and the one or more utilitarian devices associated with each control point.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: July 20, 2010
    Assignee: Inteltech Corporation
    Inventors: Dale B. Stepps, Daryl Soderman