Patents Assigned to Intera Company, Ltd.
  • Patent number: 5288544
    Abstract: The present invention is directed to operating fabric articles comprising a synthetic substrate which has been treated to render it absorbent to aqueous media and an anti-statically effective amount of a conductive fiber.
    Type: Grant
    Filed: February 28, 1991
    Date of Patent: February 22, 1994
    Assignee: Intera Company, Ltd.
    Inventors: Ted A. Mallen, Doyle B. Word
  • Patent number: 4921890
    Abstract: A process for improving the flame retardancy, hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble monomer and an organic halogen-containing hydrophobic carrier compound at a temperature of between about 40.degree. C. to 100.degree. C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a polymer evenly disposed on the substrate. The flame retardancy, hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.
    Type: Grant
    Filed: April 24, 1987
    Date of Patent: May 1, 1990
    Assignee: Intera Company, Ltd.
    Inventors: Katsumi Hayashi, Gregory A. Lentz
  • Patent number: 4790907
    Abstract: The invention is related to a method of making paper or non-woven articles, comprising treating a substrate to render said substrate durably hydrophilic; and forming said durably hydrophilic fiber into a paper or non-woven article.
    Type: Grant
    Filed: August 3, 1987
    Date of Patent: December 13, 1988
    Assignee: Intera Company, Ltd.
    Inventors: Ted A. Mallen, Doyle B. Word
  • Patent number: 4726968
    Abstract: A process for improving the hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble cross-linking vinyl monomer and an organic hydrophobic carrier compound at a temperature of between about 40.degree. C. to 100.degree. C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.
    Type: Grant
    Filed: October 16, 1985
    Date of Patent: February 23, 1988
    Assignee: Intera Company, Ltd., a Tennessee Limited Partnership
    Inventors: Katsumi Hayashi, Gregory A. Lentz