Patents Assigned to InterCon Systems, Inc.
  • Patent number: 6905343
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: June 14, 2005
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6832917
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact is formed from a length of cylindrical preplated metal wire having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: December 21, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6780056
    Abstract: A frame for holding an interposer or other circuit device sandwiched between a pair of circuit members includes an EMI shield surrounding the frame. Contact arms extend from the shield and engage the circuit members to electrically or thermally interconnect the EMI shield with the circuit members.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: August 24, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6730134
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: May 4, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6672879
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: January 6, 2004
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6607120
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: August 19, 2003
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6488513
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts in the passages. The contacts have resilient upper and lower contact arms that deflect into upper and lower recesses of the plate when sandwiched between contact pads of overlying and underlying circuit members. The recesses are sized to accommodate solder connections between contact arms and contact pads.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: December 3, 2002
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Donald W. Milbrand, Jr.
  • Patent number: 6425768
    Abstract: A clamp connector assembly for forming a plurality of electrical connections between two circuit members includes a bottom plate below the circuit members, two retention posts extending upwardly from the bottom plate and through holes in a top plate above the circuit members, two rotary clamp members mounted on the upper ends of the retention posts with offset arms extending outwardly from the posts to facilitate manual rotation of the clamp members and actuation of assembly closing connections between the members and the top plate to force the top plate toward the bottom plate, clamp the circuit members together and form electrical connections between the circuit members.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: July 30, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 6368117
    Abstract: A connector assembly includes a housing defining an interior recess, a top plate and a bottom plate on opposite sides of the housing and a compressible elastomer pad in the recess. A pin joined to one plate extends past the other plate and receives a clamp device to reduce the distance between the plates. Two circuit members are positioned between the housing and bottom plate and are held together to establish electrical connections by actuation of the clamp device.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: April 9, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 6358063
    Abstract: An interposer assembly for forming electrical connections between opposed pairs of circuit members includes a plate and metal contacts for electrically connecting the circuit members. A gasket surrounds the plate and sealingly abuts the circuit members when the interposer assembly is sandwiched between the circuit members.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 19, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6315576
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: January 2, 2001
    Date of Patent: November 13, 2001
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6290507
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are loosely confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: September 18, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, John D. Walden
  • Patent number: 6256879
    Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: July 10, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6217342
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: April 17, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, John D. Walden
  • Patent number: 6176707
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts loosely confined in the passages. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: January 23, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, John D. Walden
  • Patent number: 6036502
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: March 14, 2000
    Assignee: Intercon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 5899757
    Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts are mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crown-shaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: May 4, 1999
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 5882227
    Abstract: A controlled impedance block for connecting signal lines on a flexible cable to components on a circuit board includes a ground plane matrix surrounding adjacent signal lines. The matrix is formed from intersecting sets of ground blades with electrical connections between the blades at intersections and electrical connections with ground contact pins at intersections.
    Type: Grant
    Filed: September 17, 1997
    Date of Patent: March 16, 1999
    Assignee: Intercon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 5470238
    Abstract: A shielded ribbon cable electrical connector assembly includes a shielded cable connector with an overmolded body mounted on the end of the shielded cable and a shielded pin header adapted to be mounted on a circuit board and to mate with the connector. The connector includes a cable clamp on the end of the cable, a premolded connector block containing a row of disconnect terminals and a circuit board forming electrical connections between conductors in the cable and terminals in the connector block. A ground shield plate overlies the circuit board and includes a contact tongue which extends into the cable clamp and is held against the cable shield and a contact finger which overlies the connector block and forms a ground connection with a ground shield on the header. An overmolded plastic body surrounds the cable clamp, circuit board, connector ground shield and part of the connector block.
    Type: Grant
    Filed: February 9, 1994
    Date of Patent: November 28, 1995
    Assignee: Intercon Systems, Inc.
    Inventor: John D. Walden
  • Patent number: 5213533
    Abstract: An electrical connector assembly includes a pair of elongate connector blocks with a plurality of terminals in each block, latch members on the ends of one block and a latch assembly on the ends of other block. The latch assemblies include rotary latches and latch operators extending between the rotary latches and the adjacent body. Manual actuation of the operators rotate the latches between opened and closed positions.
    Type: Grant
    Filed: April 23, 1992
    Date of Patent: May 25, 1993
    Assignee: Intercon Systems, Inc.
    Inventor: John D. Walden