Patents Assigned to InterCon Systems, Inc.
  • Patent number: 11223152
    Abstract: An interposer assembly including a plate and a plurality of conductive contacts extending through plate passages for forming electrical connections with pads on overlying and underlying substrates.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: January 11, 2022
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: Paul R. Taylor, Trent Do, James S. Hileman
  • Patent number: 10312613
    Abstract: An interposer assembly including a plate and a plurality of metal contacts extending through passages in the plate for forming electrical connections with pads on overlying and underlying substrates. The contacts include a number of contact units with elastic cantilever and torsion springs. Current flows through the contact units with minimum resistance.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: June 4, 2019
    Assignee: Amphenol InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 9425525
    Abstract: The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 23, 2016
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman, Charles Sands Pickles
  • Patent number: 9172161
    Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: October 27, 2015
    Assignee: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman
  • Patent number: 8899993
    Abstract: The disclosure relates to interposer assembly plates with large numbers of closely spaced contact apertures extending through the plates and contact members inserted into and retained in the apertures.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 2, 2014
    Assignee: Amphenol InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Publication number: 20140162472
    Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may form an impedance shield for reducing impedance between adjacent signal contacts.
    Type: Application
    Filed: May 21, 2013
    Publication date: June 12, 2014
    Applicant: Amphenol InterCon Systems, Inc.
    Inventors: John D. Walden, James S. Hileman
  • Publication number: 20140045350
    Abstract: The disclosure relates to interposer assembly plates with large numbers of closely spaced contact apertures extending through the plates and contact members inserted into and retained in the apertures.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 13, 2014
    Applicant: Amphenol InterCon Systems, Inc.
    Inventor: Amphenol InterCon Systems, Inc.
  • Patent number: 6905343
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: June 14, 2005
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6832917
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact is formed from a length of cylindrical preplated metal wire having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: December 21, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6780056
    Abstract: A frame for holding an interposer or other circuit device sandwiched between a pair of circuit members includes an EMI shield surrounding the frame. Contact arms extend from the shield and engage the circuit members to electrically or thermally interconnect the EMI shield with the circuit members.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: August 24, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6730134
    Abstract: An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two substrates brings the contact points on each spring arm into engagement with a pad, elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: May 4, 2004
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6672879
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: January 6, 2004
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6607120
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: August 19, 2003
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6488513
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts in the passages. The contacts have resilient upper and lower contact arms that deflect into upper and lower recesses of the plate when sandwiched between contact pads of overlying and underlying circuit members. The recesses are sized to accommodate solder connections between contact arms and contact pads.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: December 3, 2002
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Donald W. Milbrand, Jr.
  • Patent number: 6425768
    Abstract: A clamp connector assembly for forming a plurality of electrical connections between two circuit members includes a bottom plate below the circuit members, two retention posts extending upwardly from the bottom plate and through holes in a top plate above the circuit members, two rotary clamp members mounted on the upper ends of the retention posts with offset arms extending outwardly from the posts to facilitate manual rotation of the clamp members and actuation of assembly closing connections between the members and the top plate to force the top plate toward the bottom plate, clamp the circuit members together and form electrical connections between the circuit members.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: July 30, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 6368117
    Abstract: A connector assembly includes a housing defining an interior recess, a top plate and a bottom plate on opposite sides of the housing and a compressible elastomer pad in the recess. A pin joined to one plate extends past the other plate and receives a clamp device to reduce the distance between the plates. Two circuit members are positioned between the housing and bottom plate and are held together to establish electrical connections by actuation of the clamp device.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: April 9, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Paul R. Taylor
  • Patent number: 6358063
    Abstract: An interposer assembly for forming electrical connections between opposed pairs of circuit members includes a plate and metal contacts for electrically connecting the circuit members. A gasket surrounds the plate and sealingly abuts the circuit members when the interposer assembly is sandwiched between the circuit members.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 19, 2002
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6315576
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: January 2, 2001
    Date of Patent: November 13, 2001
    Assignee: InterCon Systems, Inc.
    Inventor: Douglas A. Neidich
  • Patent number: 6290507
    Abstract: An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and projections extending into the passages. Metal contacts are loosely confined in the passages by the projections. The contacts include noses that project outwardly from the plate for engagement with contact pads on overlying and underlying circuit members.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: September 18, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, John D. Walden
  • Patent number: 6256879
    Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: July 10, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.