Abstract: A nest arrangement which is configured to support a substrate during a dicing process, and methods for using such a nest arrangement, are disclosed. According to one aspect of the present invention, a nest arrangement supports a substrate, which includes a first side and a second side, the first side being smoother than the second side. This nest arrangement includes a nest having a first side and a second side disposed above a vacuum retainer plate. The nest includes a locator pin for aligning the substrate with the nest when said substrate is disposed on the first side of the nest, and has a grid which defines at least one nest opening with an opening area that is smaller than an area of a chip diced from the substrate, and at least one retainer wall disposed on the first side proximate the opening area. The vacuum retainer plate has thereon at least one vacuum pedestal, which is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: A nest arrangement which is configured to support a substrate during a dicing process, and methods for using such a nest arrangement, are disclosed. According to one aspect of the present invention, a nest arrangement supports a substrate, which includes a first side and a second side, the first side being smoother than the second side. This nest arrangement includes a nest having a first side and a second side disposed above a vacuum retainer plate. The nest includes a locator pin for aligning the substrate with the nest when said substrate is disposed on the first side of the nest, and has a grid which defines at least one nest opening with an opening area that is smaller than an area of a chip diced from the substrate, and at least one retainer wall disposed on the first side proximate the opening area. The vacuum retainer plate has thereon at least one vacuum pedestal, which is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: The invention relates, in one embodiment, to an arrangement configured to support a substrate during a dicing process. The substrate has thereon a first substrate side and a second substrate side. The first substrate side is smoother than the second substrate side. The arrangement includes a nest having a first nest side and a second nest side. The nest includes a grid which defines at least one nest opening. The nest opening has an opening area that is smaller than an area of a die diced from the substrate. The arrangement further includes a vacuum retainer plate having thereon at least one vacuum pedestal. The vacuum pedestal has an upper surface formed of a resilient material. The vacuum pedestal is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: A nest arrangement which is configured to support a substrate during a dicing process, and methods for using such a nest arrangement, are disclosed. According to one aspect of the present invention, a nest arrangement supports a substrate, which includes a first side and a second side, the first side being smoother than the second side. This nest arrangement includes a nest having a first side and a second side disposed above a vacuum retainer plate. The nest includes a locator pin for aligning the substrate with the nest when said substrate is disposed on the first side of the nest, and has a grid which defines at least one nest opening with an opening area that is smaller than an area of a chip diced from the substrate, and at least one retainer wall disposed on the first side proximate the opening area. The vacuum retainer plate has thereon at least one vacuum pedestal, which is configured to be disposed through the nest opening when the nest is mated with the vacuum retainer plate.

Abstract: A nest mechanism which is arranged to support a substrate during a dicing process, and methods for using such a nest mechanism, are disclosed. According to one aspect of the present invention, a nest apparatus supports a substrate, which includes a chip, a first side, and a second side, during a dicing process, includes an alignment mechanism that positions the substrate with respect to the nest apparatus. The nest apparatus also includes a grid arrangement that defines an opening which receives a contact which is included on the second side of the substrate. In one embodiment, the alignment mechanism is an alignment pin that engages the substrate, as for example through an opening in the substrate, to hold the substrate.