Abstract: An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
Type:
Grant
Filed:
December 1, 2006
Date of Patent:
July 29, 2008
Assignee:
Interconnect Portfolio, LLC
Inventors:
Gary Yasumura, Joseph C. Fjelstad, Kevin P. Grundy, William F. Wiedemann, Matthew J. Stepovich
Abstract: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
Type:
Grant
Filed:
November 12, 2004
Date of Patent:
June 17, 2008
Assignee:
Interconnect Portfolio, LLC
Inventors:
Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, Gary Yasumura