Patents Assigned to Interconnect Portfollo LLC
  • MULTI-SURFACE IC PACKAGING STRUCTURES
    Publication number: 20110215475
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 8, 2011
    Applicant: Interconnect Portfollo LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, Kevin P. Grundy