Abstract: A flex-tolerant structure includes a flexible and foldable substrate and traces on the substrate. Each trace includes a stretch-resistant layer and a metal layer covering the stretch-resistant layer, electrical flow can persist through these layers even if the traces are fractured. A display panel is also disclosed.

Abstract: An electronic device includes a transparent first display panel, a second display panel and a processor electrically connected to the two panels. The first display panel is movable with respect to the second display panel. The processor is configured to switch between a plurality of display modes based on relative positioning of the two panels and to provide video signals to the two panels based on a current display mode. When the first display panel is parallel to the second display panel and faces a display area of the second display panel, the processor executes a stereoscopic display mode. When an angle between the two panels is between 0 and 180 degrees, exclusive, the processor executes an augmented reality display mode. When the display areas of the two panels are oriented away from each other, the processor executes a dual display mode.

Abstract: A conductive module includes spaced conductive layers and connecting lines. Adjacent conductive layers are electrically connected by one connecting line. Each connecting line includes a contact portion and an extending portion, the contact portion is electrically connected to one conductive layer and the extending portion. The extending portion is very stretchable in effective length to render the conductive module stretchable and deformable. A projection of the contact portion on a plane where the extending portion extends is a square, a width of the extending portion is equal to a side length of the contact portion.

Abstract: A single-stage gate driving circuit with multiple outputs includes a first bootstrapping circuit, a first pre-charge circuit, a first output control circuit, a second bootstrapping circuit, a second pre-charge circuit, and a second output control circuit. During a first duration, the first pre-charge circuit precharges a first node to a first voltage. During a second duration, the first bootstrapping circuit boosts the first node from the first voltage to a second voltage, and the second pre-charge circuit precharges a second node to a fourth voltage. During a third duration, the first output control circuit boosts the first node from the second voltage to a third voltage, and the second bootstrapping circuit boosts the second node from the fourth voltage to a fifth voltage. During a fourth duration, the second output control circuit boosts the second node from the fifth voltage to a sixth voltage.

Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.

Abstract: A head-up display includes a picture generation unit configured to project image light, a hexagonal optical reflection element arranged on a light path of the image light and including a hollow hexagonal cylinder, a concave mirror and an image display plate. The hollow hexagonal cylinder has a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, a fifth sidewall and a sixth sidewall which are sequentially connected to form a closed hexagonal column. The second sidewall is transparent, and the first sidewall and the fifth sidewall opposite to the second sidewall are configured to reflect the image light. The concave mirror is disposed on the light path of the image light and configured to receive the image light reflected from the hollow hexagonal cylinder. The image display plate is configured to receive image light reflected from the concave mirror.

Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.

Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.

Abstract: A very small piezoelectric sensor capable of being mass produced includes a core, a piezoelectric layer on a surface of the core; and a conductive layer on a surface of the piezoelectric layer away from the core. The core is flexible and threadlike, the core is a first electrode of the piezoelectric sensor, and the conductive layer is a second electrode of the piezoelectric sensor. An array of such sensors allows the “skin” of a robot for example to simulate the sensitivity of hair-covered human skin. A method for making the piezoelectric sensor and an electronic device using the piezoelectric sensor are also disclosed.

Abstract: A light-emitting diode display and a method for fabricating the same is disclosed. The light-emitting diode display includes a driving backplane and a plurality of pixel units. Each of the plurality of pixel units includes at least one light-emitting diode and a package substrate. The top surface of the package substrate has at least one conductive position and at least one conductive vacant position corresponding to the at least one conductive position. The conductive position is provided with the light-emitting diode. The conductive position is electrically connected to the light-emitting diode. The bottom surface of the package substrate of each pixel unit is arranged on the driving backplane. The driving backplane is electrically connected to the light-emitting diode and the corresponding conductive vacant position of each pixel unit thereon.

Abstract: A pressure sensing display module has a display area and a wiring area surrounding a periphery of the display area. The pressure sensing display module includes a force sensitive unit provided in the wiring area; and a display unit provided corresponding to the display area. Information generated by the display unit is displayed on the display area.

Abstract: A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.

Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.

Abstract: An optical assembly includes a first optical film and a second optical film. The first optical film includes first microstructures arranged in a chessboard arrangement based on a first direction. The second optical film includes second microstructures arranged in a chessboard arrangement based on a second direction. The angle between the first direction and the second direction is greater than or equal to 30 degrees and less than or equal to 60 degrees.

Abstract: A sensing film includes a base layer, a piezoelectric layer formed on the base layer, and a first electrode and a second electrode formed on the piezoelectric layer. The first and second electrodes are spaced apart and electrically insulated from each other. The first electrode includes a first connecting portion and a number of first extending portions coupled to the first connecting portion. The second electrode includes a second connecting portion and a number of second extending portions coupled to the second connecting portion. The first connecting portion and the second connecting portion are spaced apart and face each other. The first extending portions extend from a side of the first connecting portion toward the second connecting portion. The second extending portions extend from a side of the second connecting portion toward the first connecting portion. The first extending portions and the second extending portions are alternately arranged.

Abstract: A gate driving circuit includes a bootstrapping circuit, a pre-charge circuit, and an output control circuit. The bootstrapping circuit is composed of a bootstrapping capacitor and a transistor. A first terminal of the bootstrapping capacitor has a first voltage during a first duration. The pre-charge circuit is connected to the first terminal of the bootstrapping capacitor. The pre-charge circuit boosts the first terminal of the bootstrapping capacitor from the first voltage to a second voltage during a second duration. The bootstrapping circuit boosts the first terminal of the bootstrapping capacitor from the second voltage to a third voltage during a third duration. The output control circuit is connected to the first terminal of the bootstrapping capacitor. The output control circuit boosts the first terminal of the bootstrapping capacitor from the third voltage to a fourth voltage during a fourth duration.

Abstract: A curved display and a method for binding a cover glass of the curved display are provided. The curved display includes a display module, a frame body and a cover glass. The frame body has a first flat surface and a second flat surface opposite to the first flat surface, in which the first flat surface is adhered to the display module. The cover glass has a binding flat surface and an application surface opposite to the binding flat surface, in which the binding flat surface is adhered to the second flat surface of the frame body, and the application surface is a surface with curvature. The second flat surface of the frame body is set with a first alignment mark, and the binding flat surface of the cover glass is set with a second alignment mark, and the first alignment mark corresponds to the second alignment mark.

Abstract: The present disclosure provides a touch device and a manufacturing method thereof. The touch device includes a substrate, a touch electrode layer, a protective layer, and a plurality of wires. The substrate includes a first region and a second region, in which the second region is adjacent to the first region. The touch electrode layer is disposed in the first region and is completely covered by the protective layer. The protective layer has a plurality of openings. The openings expose a portion of the touch electrode layer and extend from the first region to the second region. Each wire is formed in the corresponding openings and extends from the portion of the touch electrode layer to the second region, in which each opening is partially filled with one of the wires, and thereby a recess is defined in each opening.

Abstract: An eye tracking device includes a substrate comprising a first substrate portion and a second substrate portion intersecting with the first substrate portion, an infrared light emitting element on the first substrate portion, and an image acquisition element on the second substrate portion. The infrared light emitting element is configured to emit infrared light to a user's eyeball. The image acquisition element and the infrared light emitting element are non-coplanar. The image acquisition element is configured to receive and sense the infrared light reflected by the eyeball for imaging.

Abstract: A capacitance-type sensing system for indirect contact includes a capacitance-type sensor and a grounding conductor. The capacitance-type sensor includes a sensing electrode and a driving circuit electrically connected to the sensing electrode. The driving circuit has a grounding terminal. The grounding conductor is electrically connected to the grounding terminal and configured to contact a grounding surface. A contact area of the grounding conductor is greater than or equal to 3000 mm2.