Patents Assigned to Interl Corporation
  • MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
    Publication number: 20210391273
    Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
    Type: Application
    Filed: June 16, 2020
    Publication date: December 16, 2021
    Applicant: Interl Corporation
    Inventors: Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia, Edvin Cetegen