Abstract: A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
Type:
Grant
Filed:
March 6, 2019
Date of Patent:
April 5, 2022
Assignee:
INTERLATIN S DE RL DE CV
Inventors:
Jimmy Villalvazo, Nestor Librado Castro Leyva