Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.

Abstract: An LED assembly, comprising: a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region; a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate; a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate; a plurality of LED elements arranged on the first wavelength conversion layer; a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer; a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and a plurality of electrical contacts electrically connect

Abstract: A light emitting device includes a base, a first light emitting unit, a second light emitting unit, a light conversion layer and a lens. The base has a first side slot, a second side slot, and a central slot separated from the first side slot and the second side slot, and the first side slot is formed in a separated recess configuration with a long axis and a short axis. The first light emitting unit is installed in the central slot, and the second light emitting unit is installed in the first side slot. The light conversion layer is covered onto the first light emitting unit or the second light emitting unit, and the lens covers the light conversion layer, the central slot, the first side slot, and the second side slot. The first slot and the lens have first similar contour lines in a top view.

Abstract: A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.

Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.

Abstract: Disclosed embodiments include a manufacturing method for an LED assembly. Providing a first carrier, wherein several LED chips are formed on the first carrier, and providing a second carrier. Attaching the second carrier to the LED chips and detaching the first carrier from the LED chips but leaving the LED chips on the second carrier.

Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.

Abstract: A light-emitting diode (LED) module and a method for operating the same are disclosed. The LED module is supplied through an external voltage source. The LED module includes a bridge rectifying unit, a LED unit, and an integrated circuit (IC) unit. The bridge rectifying unit rectifies the external voltage source into an inner DC voltage source. The LED unit is electrically connected to the bridge rectifying unit and driven through the DC voltage source. The IC unit is electrically connected to the bridge rectifying unit and the LED unit and is supplied through the DC voltage source, thus providing a piecewise constant-current control or a piecewise variant-current control to the LED unit.

Abstract: A LED bulb includes a circuit board, a lighting module, a conductive connector, and a lamp shade. The circuit board includes a slot. The lighting module is arranged on the circuit board and includes a transmissive substrate. The lighting module includes a circuit layer attached to the transmissive substrate, an electrode component arranged on one end of the transmissive substrate and inserted into the slot and electrically connected to the circuit layer, and a plurality of LED dies placed on the transmissive substrate and electrically connected to the circuit layer. The conductive connector is arranged on the other side of the circuit board and electrically connected to the circuit. The lamp shade is assembled with the conductive connector such that the circuit board and the lighting module are arranged between the conductive connector and the lamp shade.

Abstract: An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer.

Abstract: LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.

Abstract: An illuminant device includes a housing, a illuminant element, a resistor, and an over-temperature protective element. The housing includes an upper portion, a lower portion opposite to the upper portion, and two accommodating spaces, respectively formed in a first tubular configuration arranged between the upper end and the lower end and a second tubular configuration spatially isolated from the first accommodating space. The illuminant element is placed on the upper portion. The resistor is located within one of the accommodating space and electrically connected to the illuminant element. The over-temperature protective element is located within the other accommodating space and electrically connected to the illuminant element.

Abstract: Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate, LED chips, and first and second electrode plates. The transparent substrate comprises first and second surfaces facing to opposite orientations respectively. The transparent substrate has a via hole tunneling therethrough, which is formed with conductive material to provide a conductive via. The LED chips are mounted on the first surface. The first and second electrode plates are formed on the first and second surfaces respectively. The light emitting diode chips and the conductive via are electrically connected in series between the first and second electrode plates.

Abstract: A light-emitting lamp has a bulb shell, a convective accelerator, a light-emitting filament and a bulb base. The bulb shell defines an interior volume filled with a filling gas, and comprises a first transparent material. The convective accelerator is disposed within the interior volume, and comprises a second transparent material. The convective accelerator contains a flue with first and second openings. The light-emitting filament is disposed within the flue, comprising a plurality of semiconductor light-emitting elements. When the light-emitting filament emits light to generate heat, the flue allows a convection flow of the filling gas to pass into one of the first and second openings. The bulb base supports the bulb shell and the light-emitting filament, and has electrical conductors in electrical communication with the light-emitting filament. The first and the second openings have different distances apart from the bulb base.

Abstract: A light emitting component, and more particularly to a white light emitting component with high light emitting efficiency are provided. The white light emitting component with high light emitting efficiency has properties of high driving voltage, high color render index and concentrated optical density. The light emitting component includes a plurality of different light emitting diode chip groups for emitting a number of lights in different wavelength ranges and a wavelength conversion fluorescent material. A manufacturing method by stacking miniature light emitting diode chip groups to form the white light emitting component is also provided.

Abstract: An illuminant device with over-temperature protection is electrically connected to a power source and includes a housing, a illuminant element, a resistor, and an over-temperature protective element. The housing includes an upper portion, a lower portion opposite to the upper portion, and two accommodating spaces communicating with the upper end and the lower end respectively. The illuminant element is placed on the upper portion. The resistor is located within one of the accommodating space and electrically connected to the illuminant element. The over-temperature protective element is located within the other accommodating space and electrically connected to the illuminant element. The over-temperature protective element senses temperatures of the illuminant element and selectively breaks the power source, such that the illuminant element is switched between conductive and non-conductive.

Abstract: A light emitting device includes a substrate, a plurality of rectifier diodes, and at least one light emitting diode (LED) module. The substrate has a first cavity, a second cavity, and a third cavity formed thereon. The rectifier diodes are arranged in the first cavity and the third cavity respectively. The LED module is arranged in the second cavity. The LED module includes a plurality of LEDs. The light emitting device is capable of rectifying and converting an alternating current (AC) power supply to drive the LEDs to emit light.

Abstract: A light emitting device includes a light emitting unit and a submount. The light emitting unit has a plurality of light emitting diodes (LEDs), and the submount has a plurality of conductive contacts on a side thereof. The LEDs are coupled to the conductive contacts in various electrical connection manners, such that the LEDs are connected in series or/and in parallel.

Abstract: A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.

Abstract: A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period.