Patents Assigned to International Business Machines Corporation or ITR, LP; IT AG; UMC, etc.
  • Low Cu percentages for reducing shorts in AlCu lines
    Publication number: 20040020891
    Abstract: In a method of fabricating a metallization structure during formation of a microelectronic device, the improvement of reducing metal shorts in blanket metal deposition layers later subjected to reactive ion etching, comprising:
    Type: Application
    Filed: July 31, 2002
    Publication date: February 5, 2004
    Applicants: Infineon Technologies North America Corp., International Business Machines Corporation or ITR, LP; IT AG; UMC, etc.
    Inventors: Roy C. Iggulden, Padraic Shafer, Kwong Hon Wong, Michael M. Iwatake, Jay W. Strane, Thomas Goebel, Donna D. Miura, Chet Dziobkowski, Wemer Robl, Brian Hughes