Abstract: A soldering gun has a finger actuated rotary solder feed unit and a solder cartridge releasably coupled to the gun. A solder guide tube extends forwardly parallel to the cylinder and guides the solder into engagement with the heated tip. The guide tube is mounted for vertical and angular orientation relative to the cylinder for locating the solder relative to the tip. A rotating ratchet feed wheel is connected to the trigger and has teeth engaging the underside of the solder. A set screw is located in the path of trigger to adjust the trigger stroke and thereby the length of the solder fed to the tip. A pressure wheel is mounted to firmly hold the solder to the feed wheel and is secured to a spring-loaded and pivoted T-shaped lever within the gun housing. The T-shaped lever has the pressure wheel rotatably mounted in the cross bar and the stem projecting upwardly into engagement with a bias spring. The lever has a release arm for manual pivoting of the lever to release of the solder.