Patents Assigned to International Electronic Research Corp.
  • Patent number: 5937518
    Abstract: A finished workpiece of malleable metal containing a saw cut which does not require deburring because the small burr on the exit side of the cut is concealed within a three sided notch. An elongated notch, closed on three sides, is formed on the side of the blank workpiece from which the saw blade exits. The depth of the cut is adjusted so that the bottom of the cut, together with its attendant burr, intersects with the notch. The burr is thus attached to a wall within the notch. The width of the notch is adjusted so that the anticipated tolerance in the depth of the cut (and thus the location of the bottom of the cut) is accommodated. The width of the notch is such that the bottom of the cut will intersect the notch at any location within the anticipated tolerance envelope. The depth of the notch is sufficient to conceal the burr.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: August 17, 1999
    Assignee: International Electronic Research Corp.
    Inventor: Ronald E. Steiner
  • Patent number: 5854739
    Abstract: A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: December 29, 1998
    Assignee: International Electronic Research Corp.
    Inventors: Ronald E. Steiner, Peter S. Chow
  • Patent number: 4967260
    Abstract: A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.
    Type: Grant
    Filed: May 4, 1988
    Date of Patent: October 30, 1990
    Assignee: International Electronic Research Corp.
    Inventor: Sheldon H. Butt
  • Patent number: 4502601
    Abstract: A guide for slidably accepting opposite edges of a sheet of material which may be an electronic circuit board or metal plate attached thereto and which makes use of a rotating camming bar in a retainer as a clamp has rotational stop and drive means built in a way to minimize servicing and replacement problems. On those occasions where the stop and drive means are pins, the bar and pins can be assembled prior to insertion in the retainer and bars can be individually removed and replaced. The pin relationship is furthermore such that any relative weakness in the structure is relegated to an exterior more easily accessible location to avoid unnecessary disassembly of parts when a bar needs repair or replacement.
    Type: Grant
    Filed: October 18, 1982
    Date of Patent: March 5, 1985
    Assignee: International Electronic Research Corp.
    Inventors: Martin D. Husted, Norman J. Schuster
  • Patent number: RE29784
    Abstract: A metal core printed circuit board which includes multiple layers of synthetic plastic resin material on a sheet of metal, and wherein the surface of the plastic material is of such character that it provides an acceptable bond on which are built up sundry layers of different metals, the innermost layer on the plastic surface and the other layers positioned one upon another, ultimately comprising a built up circuit pattern, and wherein areas intermediate the circuit pattern comprise an exposed surface of the resin material.
    Type: Grant
    Filed: June 28, 1974
    Date of Patent: September 26, 1978
    Assignee: International Electronics Research Corp.
    Inventors: Donald H. Chadwick, Ruben T. Apodaca
  • Patent number: D422970
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: April 18, 2000
    Assignee: I.E.R.C. (International Electronic Research Corp.
    Inventor: Fred Guerrero